Electronics Forum | Fri May 01 07:22:56 EDT 2009 | kareal
In my project of flip chip PGA production , I found serious delamination in interface of solder mask and first layer copper trace of substrate after UHAST 96hrs( 130C, 85%RH) reliability test. The delamination are always around one type solder bump,
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
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GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php
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solder balls, to avoid bridging to obtain good welding quality Get better welding quality is particularly important and can use a lower-activity flux paste, but also can improve the performance of the joints, to reduce the discoloration of the substrate
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