Electronics Forum | Mon Jul 24 11:35:42 EDT 2006 | Jimk@ics-inc.org
We have experienced a problem with tin leaching or discoloration of lead terminals on random parts on solder side of a paste/paste operation. The profile has been used on previous production runs and there doesn't appear to be any heat damage to othe
Electronics Forum | Wed Jan 12 10:41:20 EST 2011 | padawanlinuxero
Hello guys ! I have a problem, I am finding some blow holes in the solder join in a resistors pad, can this be because of high humidity in the board? does baking the boards fix the problem? thanks
Industry News | 2021-10-31 21:32:05.0
At present and in the future, the maintenance of the electrical control equipment, VFD (Variable Frequency Drive) will become the professional knowledge that all electricians need to master. As a reliable supplier of leading brands of VFDs for many years, OKmarts now shares ten simple and easy maintenance methods to the majority of VFD maintenance technicians. Hopefully these experience can help you in the maintenance of VFDs.
Industry News | 2021-12-06 20:13:05.0
At present and in the future, the maintenance of the electrical control equipment, VFD (Variable Frequency Drive) will become the professional knowledge that all electricians need to master. As a reliable supplier of leading brands of VFDs for many years, OKmarts now shares ten simple and easy maintenance methods to the majority of VFD maintenance technicians. Hopefully these experience can help you in the maintenance of VFDs.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
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