Electronics Forum | Fri Sep 14 02:18:32 EDT 2001 | gsparka
Hi. After reflow soldering. There are lots of non wetting of leads. 71 b'd all are mounted resister,condensor,qfp,plcc,bga have got the defects so many. all defecs occured in the fine pitch ic. others are good. On some fine pitch pads not mou
Electronics Forum | Tue Jul 18 05:39:25 EDT 2006 | rocko
Hello all, After lead-free reflow process of single side assembled PCB I have a problem with a tensile strenght of SMT transformers - I can rip the parts from the board very easily. There is very good component leads wetting (optical inspection)
Industry News | 2020-06-18 14:14:42.0
MIRTEC is pleased to announce that Out of the Box Manufacturing has purchased an MV-6 OMNI to meet their ongoing commitment to continuous process improvement. The Award-Winning MV-6 OMNI is the perfect 3D Inspection Solution to enable OBMFG to provide their customers with flawless manufacturing quality and consistent on-time deliveries all at a competitive price!
Industry News | 2021-10-11 16:13:11.0
MIRTEC will showcase its cutting-edge INTELLI-PRO AI Based Smart Factory Automation Solution and GENSYS-PIN Automotive Pin Inspection System in booth #461, Hall A2 at the 2021 Productronica exhibition. The world's largest exhibition for the electronic manufacturing industry will take place on Nov. 16-19, 2021, at Messe Munich exhibition hall in Germany.
Technical Library | 2023-01-17 17:35:07.0
After years of concentration on resolving productivity- related concerns such as increasing speed, consistency and throughput while reducing costs, many of the world's leading electronics manufacturers have added a new mandate to their agendas. They are seeking to minimize the environmental impacts of their assembly processes and final products without sacrificing the high levels of productivity and quality that have been achieved through decades of effort.
Technical Library | 2012-10-04 18:52:43.0
First published in the 2012 IPC APEX EXPO technical conference proceedings... Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball t
The LPKF ProtoFlow S reflow oven, with lead free capability, has significant advantages over previous models and rich features including a PC control software package. Learn more: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/solder
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
. The purposes of all process controls during surface mounting are to realize high soldering quality. If there is no reasonable and feasible reflow soldering process, any process control before said makes no sense
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
. Through hole paste reflow can benefit using solder bricks to increase joint volume and decrease flux residues. Some placement machine suppliers offer produced cut and form feeders, so solder wire is used, reducing the cost of simple preforms Back in the day the presenter used preforms with vapour phase and