Electronics Forum | Tue Mar 25 02:58:24 EDT 2014 | molder
ok.. thanks you so much.. I will buy new dispenser siringe, and I try to rework... I have a questions on desolder and solder a socket 1366 intel on motherboard. I have a rework station Honton hot air and tornado infrared, but i don't know a temperatu
Industry News | 2009-05-26 18:16:29.0
In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
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world’s leading manufacturers for their sealing and ambient temperature adhesive applications. From epoxy to thermal paste, silicone to acrylic, 1 or 2 component, we dispense it all. ©
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