Electronics Forum | Tue Mar 25 02:58:24 EDT 2014 | molder
ok.. thanks you so much.. I will buy new dispenser siringe, and I try to rework... I have a questions on desolder and solder a socket 1366 intel on motherboard. I have a rework station Honton hot air and tornado infrared, but i don't know a temperatu
Industry News | 2009-05-26 18:16:29.0
In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
SMTnet Express, December 20, 2018, Subscribers: 31,551, Companies: 10,666, Users: 25,526 Process Optimization for Fine Feature Solder Paste Dispensing Credits: Indium Corporation With the rapid trend towards miniaturization in surface mount
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/products/nozzles/dispense-valve-nozzles
world’s leading manufacturers for their sealing and ambient temperature adhesive applications. From epoxy to thermal paste, silicone to acrylic, 1 or 2 component, we dispense it all. ©
Lewis & Clark | https://www.lewis-clark.com/it-is-auction-time/
It is AUCTION TIME~ - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal: $ 0.00 View Cart Checkout Lewis and Clark, Inc
