Industry Directory | Manufacturer
Suppliers of adhesive and dispensing solutions. Techcon dispensers, metering valves, robots, plastic components, air guns and accessories. Henkel Sicomet anaerobic and cyanoacrylate adhesives, Henkel Dexter epoxy resins and adhesives, Jenome dispensing robots. Keltech pressure pot dispensers. Packaging service for transfer of adhesives from drums, pots or cans into syringes and cartridges.
Industry Directory | Consultant / Service Provider / Manufacturer
Providing Belting/Sequencing Tape for Electronics Industry,bandoliering tape 6mm*3000m,thermal melting tape,active and passive component processing,axial taping and radial lead forming for capacitor,LED diode .sales2@chinatape.com
The system is an optimal solution for hot glue applications. Hot melt, a thermoplastic adhesive perfectly changes its solid state to liquid when passing through the zones of increasing temperature; an ideal application for the electronic industry, e.
Materials: Backing: flat back paper Adhesive: rubber Thickness: 0.13mm Adhesion: 7N/in Ball tack (No.#14): 10 Holding power: 72hrs Tensile strength: 150N/in Elongation: 1% Applications: widely used in masking of diode belting Features: Ada
Electronics Forum | Wed Dec 08 10:03:48 EST 1999 | Ken Daniels
I have a problem dispensing chip adhesive while boards are still hot from the topside process. Has anyone else seen this? Is it a matter of my material, or the machine (Fuji GL 5) or the mask. When I try to dispense I get a great deal of stringin
Electronics Forum | Wed Dec 08 18:40:39 EST 1999 | shane.M
We encounter a similar problem, whereby stringing becomes a real problem when board temperatures are raised. We tried slightly larger dots, but this did nothing more than block the nozzles of the pick & place machine. You basically have only two opt
Used SMT Equipment | Adhesive Dispensers
Speedline Technologies Camalot FXD Underfill Dispensing System with Smart Stream Technology For Sale We have (2) identical systems available..... Both can be inspected under power..... Equipment Description Camalot FX-D Model: 8000-1 Year 5/
Used SMT Equipment | Adhesive Dispensers
Speedline Technologies Camalot FXD Underfill Dispensing System with Smart Stream Technology For Sale (2) identical systems available..... Both in very good running condition and can be inspected under power..... See attached pictures and inform
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to
SMTnet Express July 18, 2013, Subscribers: 26169, Members: Companies: 13430, Users: 34947 Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods by Fan Gao, Karunaharan Rajathurai, Qingzhou Cui, Guangwen Zhou
SMTnet Express, July 1, 2015, Subscribers: 22,969, Members: Companies: 14,445, Users: 38,464 Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi Joseph M. Juarez, Michael Robinson, Joel Heebink; Honeywell International
GPD Global | https://www.gpd-global.com/hot-melt-dispensing-electronics.php
Hot Melt Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_microjoin_4100hotbar_bonder.html
microjoin b4100 hot bar bonder Micro Join B-4100 Series Hot Melt Bar Bonder MicroJoin Model Number: B41CVBCA0B0DA00 Serial Number
