Industry Directory | Manufacturer
Wisman High Voltage Power Supply Co.,Ltd, is the professional X-ray generator, DC high voltage power supply, PCB mount module and X-ray source manufacturers.
AGGGC811* Fuji Dispersion Plate Powerful inventory supply system is the strength of Extension ,can supply high quality goods to every clients. welcome to contact me via my email tech@smtpark.com
FUJI XP Plate Dispersion ADNGC8391 FUJI XP Plate Dispersion ADNGC8391 SMT Spare Parts FUJI Spare Parts Delivery time: 1-3 days Product description: FUJI XP Plate Dispersion ADNGC8391 INQUIRY FUJI XP Plate Dispersion ADNGC8391 Specif
Electronics Forum | Mon Apr 25 21:52:58 EDT 2005 | KEN
I wonder if yor customer means wrong "flux"? Your not solderng to gold. Your soldering to Nickle. The gold is disolved and dispersed. Your joint strength comes from the SnNi intermetalic.
Electronics Forum | Thu Oct 25 21:04:18 EDT 2001 | davef
You are correct. So, the unit amount of gold [based on IG plating thickness, size of the pad, etc.] dissolves in the solder very quickly. When the solder is liquid for: * A long time, the gold disperses more. * A short time, the gold concentrates a
Used SMT Equipment | SMT Equipment
Many Fuji Sparr parts for sales.. No Part No. Description Qty. Machine 1 GPH4580 HOLDER 7 CP43 2 MPH0472 PISTON 19 CP43 3 GPL1200 PIN 8 CP43 4 S1046A CIR-CLIP WR19 10 CP43 5 PPQ1020 PIN,LOCATING 1 CP43 6 GXT2333 HOLDER,PIN 2 CP43 7 MPA5031 COLLAR 2 C
Industry News | 2020-11-24 00:34:15.0
The ultrasonic spray dryers are targeted for laboratory applications.Equipped with a non-clogging ultrasonic atomizing nozzle, designed to handle water-based and solvent-based liquids. The machine is equipped with formula storage and data recording functions, as well as an ultrasonic dispersion syringe and heating plate.
Industry News | 2017-07-19 21:09:38.0
STI Electronics is pleased to announce the acquisition of a new Fischerscope X-ray XDAL 237 energy dispersive X-ray fluorescence (EDXRF) system.
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Parts & Supplies | Chipshooters / Chip Mounters
FUJI PLATE DISPERSION AGGGC8043 WPA1420 SPRING WPA1201 HOOK,SPRING WPA1721 SPRING WPA1543 BKT WPA1552 BKT S2085H CYLINDER,AIR WPA1560 BKT WPA1570 WASHER WPA1710 PIN H31811 PLATE,END WPQ0082 BOLT,STUD WPQ0451 BOLT,STUD GPH4491 ROLLER H4
Parts & Supplies | Chipshooters / Chip Mounters
FUJI PLATE DISPERSION AGGGC8053 W1023A WASHER,LOCK W1045A WASHER,FLAT W1014A WASHER,CONICAL W1013A WASHER,CONICAL H5348A BOLT,HEXSOCKET H5345A BOLT,HEXSOCKET H5343A BOLT,HEXSOCKET H5342A BOLT,HEXSOCKET H5341A BOLT,HEXSOCKET H5326A BOLT,HEX
Technical Library | 2019-06-21 10:39:15.0
Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.
Technical Library | 2018-04-18 23:55:01.0
Higher functionality, higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve the requirements of these devices, designs must incorporate fine line and via pitch while maintain good circuitry adhesion at a smooth plating-resin interface to improve signal integrity. The Semi-Additive Process (SAP) is a production-proven method used on low dielectric loss tangent (Df) build-up materials that enables the manufacture of ultra-fine circuitry. (...) This paper will discuss a new SAP process for low loss build-up materials with low desmear roughness (Ra= 40-100 nm) and excellent adhesion (610-680 gf/cm) at various processing conditions. Along with the process flow, the current work will also present results and a discussion regarding characterization on the morphology and composition of resin and/or metal plating surfaces using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX), surface roughness analysis, plating-resin adhesion evaluation from 90o peel tests
SMTnet Express, May 12, 2022, Subscribers: 25,588, Companies: 11,569, Users: 27,213 Electronics Manufacturing Technical Articles Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/solutions/lighting-and-led
throughput with our automated assembly applications such as: Potting / encapsulation Thermal dispersion / Heat Management Gasketing Bonding Sealing
GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/PBFT-VS-SPC-User-Guide-20041102-PBT-002_CD-FORCEWare-v3-3.pdf
. Power Source Operate the PBFT only from the type of power source indicated on the data plate. Grounding The PBFT is equipped with a 3-wire grounding type plug
