ALX Technical is a manufacturer of ESD (Static Dissipative) Paper, Cleanroom Paper, and ESD Cleanroom Paper as well as ESD (Static Dissipative) Packaging products.
Provider of Assembly and Rework Stencils, Static Dissipative Inspection Templates, and Photoplotting
New Equipment | Test Equipment
IN-CIRCUIT TESTER PMP-816SII Feature ▶The instructions are synchronized with the screen results ▶Equipped with Safety Light Curtain ▶Flip door, More convenient operation ▶Double hydraulic lever, More steady operation ▶Equipped with air switch, more
New Equipment | Test Equipment
IN-CIRCUIT TESTER PMP-818S Feature ▶The instructions are synchronized with the screen results ▶Equipped with Safety Light Curtain ▶Flip door, More convenient operation ▶Double hydraulic lever, More steady operation ▶Equipped with air switch, more sa
Electronics Forum | Wed Apr 05 08:33:36 EDT 2000 | Robert Hartmann
Can someone lead me to some articles or technical standards showing formulas/design criteria for thermal management in a BT BGA? I need to be able to dissipate about 4 Watts, and am having trouble finding information on how to calculate what our BGA
Electronics Forum | Wed Apr 05 22:31:51 EDT 2000 | Dave F
Robert: Out of curiosity, by "BT" do you mean: � Bismaleimide triazine, the stuff used to increase the tg of resins used in some BGA interposers. � British Telecommunications plc, the guys with bad teeth. � BrookTree, the RAMDAC supplier, that�s par
Used SMT Equipment | Conveyors
The Cimtrak® Bare Board Mechanical Gravity Destacker from Simplimatic Automation is a modular high-speed method for unloading unpopulated printed circuit boards (PCBs) onto an electronics assembly line. Each unit is capable of independent operation u
Industry News | 2003-05-30 08:09:11.0
A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.
Industry News | 2003-04-23 08:21:34.0
Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.
Parts & Supplies | Pick and Place/Feeders
Retrofit kit heat dissipation location 1
Parts & Supplies | Pick and Place/Feeders
Retrofit kit heat dissipation location 4
Technical Library | 1999-05-06 10:30:06.0
Augmentation of extended surfaces used to dissipate heat increases the overall effectiveness of a heat sink and increases the heat removed per unit volume. This amount of increase depends on the number of augmentations, air flow velocity and ...
Technical Library | 2010-01-06 22:27:03.0
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.
Logic - Gates, and Inverters Features: High noise immunity Low power dissipation SOT353-1 and SOT753 package options ESD protection: HBM JESD22-A114E: exceeds 2000 V MM JESD22-A115-A: exceeds 200 V CDM JESD22-C101C: exceeds 1000 V Specified from?40°C
Intrinsic Quality is pleased to offer a variety of Test Fixture Development Services that include fixture building, tester interface building, harness building, troubleshooting, maintenance, design, and engineering. IQ’s fixtures are built to exactin
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: Ability to handle compliance issues NEBS, EMI/EMC UL and various customer requirements, required to handle first product builds, BOM's and ECO's. Duties/Functions: Taking requests for new products and coordinating new development
Career Center | Murphy, North Carolina USA | Engineering
We are seeking a qualified and experienced senior design engineer to join our team. The best candidate will use both mechanical and electrical engineering skills to design innovative power supplies that are highly efficient, rugged, and have high rel
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
| http://etasmt.com/cc?ID=te_news_industry,26961&url=_print
. And our epoxy resin and BT are all organic materials. 2. Inorganic materials: ① Aluminum substrate: The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function
Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/
. Thermal management for proper heat control can also strongly influence cost, weight, size, and power requirements. PCB Heat Dissipation The two primary methods of removing heat from a circuit board are convection and conduction
