Shellac is a kind of non-toxic natural gum resin dissolves in a wide variety of alkaline or rapidly drying alcoholic solvents but is resistant to a number of other solvents particularly hydrocarbons. The low thermal conductivity and a small coefficie
New Equipment | Cleaning Agents
CYBERSOLV® C8622 is a full strength solvent blend specifically designed as an IPA alternative in stencil wiping and manual bench top cleaning applications. Easy to use, C8622 is applied in applications where IPA is typically used. Safe IPA Alterna
Electronics Forum | Wed Jan 30 17:12:45 EST 2013 | dyoungquist
Solvent makes me think of dissolve which leads me to cleaning something. If you are trying to clean stencils, blades, etc. try this link to the product we use: http://www.techspray.com/product-info.php?pId=3&cId=17
Electronics Forum | Mon Apr 29 22:32:59 EDT 2002 | davef
See, I didn�t bite on you zinc diffusion trick that you tried to pull last week. Understand, in this response, I am NOT trying to bust you. I�m trying to determine what you are looking to understand. [Some times I get so locked into talking a cert
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-12-08 03:35:10.0
Top 10 Consumer Electronics Companies in the World
Technical Library | 2017-10-12 15:45:25.0
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.
Technical Library | 2010-06-10 21:01:48.0
This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies.
Automatic Concentration Monitoring System ZESTRON® EYE is a digital monitoring system that enables the precise measurement and control of the cleaning bath concentration for electronics cleaning processes in real time even in presence of dissolved c
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Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
Validity of the IPC R.O.S.E. Method 2.3.25 Researched Validity of the IPC R.O.S.E. Method 2.3.25 Researched This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Drawbridging See Tombstoning . E ENIG Surface finishing process of electroless nickel followed by immersion gold. During soldering the gold is dissolved into the solder joint
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. But too thick an intermetallic layer has an adversely effect because it is generally the most brittle part of the solder joint. Compared to lead-based solders, SnAgCu solders require a higher reflow temperature which leads to accelerated diffusion rates
