Industry Directory | Manufacturer
LEDA does electronic contract manufacturing for the aerospace defense industry. LEDA is a design and manufacturing for cable assemblies, pcb assy and box builds.
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
New Equipment | Rework & Repair Equipment
Orange Sticks with double beveled ends, 7" x 5/32" (SH-83) The Beau Tech orange sticks are made of high quality non-resin wood which will not contaminate solder and component leads. Natural wood is among the best material that does not gen
Electronics Forum | Sun Feb 16 20:52:34 EST 2014 | staylorebad
IPC-4552 says it does. It specifically talks about ball grid array (BGA) pads so small feature size is included as valid. Scott
Electronics Forum | Mon Sep 14 11:29:11 EDT 1998 | Anderson Dutra
Reading some technical report I found the term "CSP", but no explanation. I guess something about Chip Scale Package... but not sure. Could someone please explain it to me? Rgds, Anderson
Used SMT Equipment | In-Circuit Testers
This machine is available for immediate purchase. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Condition: Complete & Ope
Used SMT Equipment | Depanelizers / Routers
This machine is available for immediate purchase. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Condition: Complete & Ope
Industry News | 2018-02-12 12:28:00.0
GPD Global introduces its NEW full-featured benchtop dispensing robot system: Catalina. A benchtop system does not mean "no features". This compact and efficient semi-auto dispense robot provides you with numerous standard features: automatic vision, laser surface sensing, and automatic nozzle alignment and calibration.
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Parts & Supplies | Pick and Place/Feeders
Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, highquality new modular placement machine RX 7 listed Component placement speed (best conditions): 75000 CPH chip components Element size: 0
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2013-09-25 20:57:24.0
Conformal coating is an enabling process that allows for the ruggedizing of electronic devices and modules. As the process increases the durability of electronics that are subjected to various end-use environmental conditions, it adds value to the product. While it does add value, consumers and manufacturers expect the electronics to work when subjected to dirt, humidity, moisture, corrosive materials, and various other contaminants. This expectation results in a drive to minimize the cost of the process. The lowest cost of ownership for a conformal coating process occurs by utilizing automated selective conformal coating equipment.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
ProntoGERBER-CONNECTION software is used by electronic manufacturer & imports raw Gerber data & allows the user to add intelligent information to the shapes on the display and creates real reference designators, theta rotation, part numbers, X/Y comp
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Events Calendar | Wed Jun 20 00:00:00 EDT 2018 - Wed Jun 20 00:00:00 EDT 2018 | ,
Consider the options-How should I mask for Conformal Coating?
Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA
San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components
Career Center | Houston, Texas USA | Engineering,Production,Quality Control
Houston electronics manufacturing company with nationwide locations is looking for a Quality Assurance Engineer with 1-5 years experience. Must also have knowledge of SMT and be willing to relocate. Great benefits! Salary up to 55K DOE DEGREE Requi
Career Center | Asheville, North Carolina USA | Production
Person needs to have Quad QSP-2 schooling or 2-3years experience in operating and programing. Pay DOE
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_setup-library-directory-does-not-work_topic955.xml
PCB Libraries Forum : Setup Library Directory Does Not Work PCB Libraries Forum : Setup Library Directory Does Not Work This is an XML content feed of
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