Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
New Equipment | Soldering - Other
ASCEN solder dross separator used in the PCB electronic industry,it is designed to recover pure tin and solder dross from working impurities oxides generated from the wave soldering with lead or lead free process.This tin slag recycling machine not o
PCB cutting machine For internal strength generates during separation, Minimize it to value under 180uE ,to avoid PCB solder crack or component damage ASCEN technology as the PCB separator manufacturer provide all kinds of PCB cutting machine equipm
Used SMT Equipment | Soldering - Selective
This machine will be coming available for purchase soon. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: Version
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Used SMT Equipment | Soldering - Wave
This Lead Free wave was building boards 01 of 2016 and is ready to go. It has Lambda and chip waves but the Lambda was uninstalled because they did not use. I have it and it does come with the machine.
Industry News | 2003-05-28 08:20:13.0
Aiming to promote its environmental activities on a global basis, the use of lead-free solder conforms to the European Union's regulation on restrictive use of toxic substances.
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Technical Library | 2024-06-23 22:03:59.0
The melting temperatures of most lead-free solder alloys are somewhat higher than that of eutectic Sn/Pb solder, and many of the alloys tend to wet typical contact pads less readily. This tends to narrow down the fluxing and mass reflow process windows for assembly onto typical organic substrates and may enhance requirements on placement accuracy. Flip chip assembly here poses some unique challenges. The small dimensions provide for particular sensitivities to wetting and solder joint collapse, and underfilling does not reduce the demands on the intermetallic bond strength. Rather, the need to underfill lead to additional concerns in terms of underfill process control and reliability. Relatively little can here be learned from work on regular SMT components, BGAs or CSPs.
This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert
ASCEN solder dross separator used in the PCB electronic industry,it is designed to recover pure tin and solder dross from working impurities oxides generated from the wave soldering with lead or lead free process.This tin slag recycling machine not o
Training Courses | | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Career Center | Irvine, California USA | Production
SMT Soldering/Solder Touch-Up/Rework Inspect and touch-up SMD type assemblies Read and implement rework instructions Identify and pull parts from stock for rework Perform visual inspection Manually place component onto PCBs on automated assembly line
Career Center | Rochester, New York USA | Engineering
Job Description: Implements and analyzes manufacturing engineering plans and projects. Designs, develops and transfers manufacturing and engineering tools, strategies and systems. Develops manufacturing strategies for specific products and processes
Career Center | Georgetown, Penang | Engineering
Philips Lumileds Lighting Sdn. Bhd Position Title : SMT Engineer Specialization : Manufacturing/Production Operations Industry : Electrical & Electronics Duration : May 2006 - Present Work Description: To conduct NPI & all SMT related process in Lu
Career Center | rochester, New York USA | Engineering
Skill Set . ASQ: Certified Six Sigma Green Belt (CSSGB) (Appearing 12/01/2007) . SMT Process Related Skills . Stencil Printing . Reflow Profiling . Selective Soldering . Rework . RSlogix � Programmable Logic Controller . Minitab 15.1 . Arena - Manu
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-228.pdf
. Instead of reaching liquidus at 183°C, as tin/lead solder does, the lead-free pastes melt at anywhere from 195° to 227°C, depend- ing on the formulation
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2167.html
Posted: 26 Oct 2012 at 7:04am All pad shapes are Lead-Free. The pad shape has nothing to do with Lead-Free. The Rounded Rectangle Pad Shape is excellent for both Lead and Lead-Free solder
