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987 double reflow with heavy weight plcc package - stoney tsai results

Express Newsletter: double reflow with heavy weight plcc package - stoney tsai (987)

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com

Featured Article Return to Front Page REFLOW SOLDERING

Organic Flip Chip Packages for Use in Military and Aerospace Applications

Organic Flip Chip Packages for Use in Military and Aerospace Applications  Featured Article Organic Flip Chip Packages for Use in Military and Aerospace Applications Endicott Interconnect Technologies David Alcoe, Kim Blackwell and Irving Memis

987 Express Newsletter Results

double reflow with heavy weight plcc package - stoney tsai searches for Companies, Equipment, Machines, Suppliers & Information

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