Industry Directory | Manufacturer
GMA IS A CONTRACT MANUFACTURER OF PRINTED CIRCUIT BOARD ASSEMBLIES, TESTING AND INTEGRATION INTO HIGHER LEVEL ASSEMBLIES OR PRODUCTS.
Industry Directory | Consultant / Service Provider / Manufacturer
Specializing in electronic circuit board assembly services. Various capabilities include engineering, assembly, designing, prototyping,supply chain management, testing, documentation, rework, repair and soldering. On-time delivery
New Equipment | Cleaning Equipment
SMT PCB Cleaner UC-250WM Conveyor height 900±25 mm PCB size 50﹡50~330﹡250 mm Width adjustment Manual Weight About 120 kg Product description: SMT PCB Cleaner UC-250WM, Conveyor height 900±25 mm, PCB size 50﹡50~330﹡250 mm, Width
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
Industry News | 2018-10-18 09:57:05.0
Why is my PCB Assembly Quote so Expensive?
Industry News | 2018-10-18 09:48:34.0
How much does Automated PCB Assembly Cost?
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
Welcome to this Bob Willis Defect of the Month video on BGA inspection, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years there
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
SMTnet Express, June 6, 2024, Subscribers: 25,634, Companies: 12,174, Users: 29,037 █ Electronics Manufacturing Technical Articles Effect of Multiple Reflow Cycles on Intermetallic Compound Creation This paper deals with the effect
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/explorer-one
. Our unique double oblique detector geometry inspects 300 x 300 mm boards from every side without requiring a size restricting rotation table
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
reference [7], an optimum gold thickness was determined. At the low end, the gaps in the plating resulted in voiding. At the high end, excess IMC growth occurred during reflow and reliability testing. The bondline thickness (BLT) of indium solder preforms is
