Industry Directory | Manufacturer
FAROAD, located in Shenzhen, China, has been acting professionally in SMT EQUIPMENT manufacture from the year 2006, concentrating on providing the finest quality equipment at an affordable price.
Industry Directory | Manufacturer
GMA IS A CONTRACT MANUFACTURER OF PRINTED CIRCUIT BOARD ASSEMBLIES, TESTING AND INTEGRATION INTO HIGHER LEVEL ASSEMBLIES OR PRODUCTS.
New Equipment | Board Handling - Conveyors
Product features: This type of handprint table is mainly designed for single and double-sided circuit board solder paste or red glue printing requirements. The working platform is processed by honeycomb positioning holes of high-quality aluminum pla
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Electronics Forum | Tue Jun 13 21:53:31 EDT 2000 | Dave F
This site is dedicated to double sided reflow and solder balls. Wasssup?
Electronics Forum | Tue Jun 13 21:18:02 EDT 2000 | sachi
is there a site or any information available for double sided reflow? Our compnay is rather new to this proceess and before we get deep i'd like to know more about it.
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Industry News | 2022-12-14 12:21:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.
Industry News | 2023-04-11 09:52:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Parts & Supplies | Assembly Accessories
Supply SMT Fuji placement machine accessories FUJI XP242 Feida interface board ADEEE6700 ADEE6700 Supply SMT placement machine accessories JUKI CB thimble L = 64.10mm Supply SMT Fuji FUJI placement machine QP electric Feida 24MM cover AKDDC6561 AKD
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
Technical Library | 2012-12-26 20:18:50.0
①Single side The basic flexible printed circuit board is used of substrate of single side pcb materials and coated coverlay after finishing printed. ②Double sided That is made of substrates of double sided printed circuit board with double surface coated coverlays after finishing printed. ③Single copper foil with double coverlays Single copper foil coated different coverlays with double surface after finishing printed. ④Air gap Laminating two single printed circuit board together with no glue and bare design to meet high flexibility requirements. ⑤Multilayer That is designed for three and above circuit layers by laminating single side printed circuit board or double sided printed circuit board. ⑥COF IC chips and electronic components are installed on the flexible circuit board directly. ⑦Rigid-Flexible PCB Combined to rigid PCB with supporting and flexible PCB with high flexibility.
DIP Double-side Camera Online AOI Machine ETA-V5300 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | , | Engineering,Production
Manufacturing Engineer - AOI Will develop, implement, and maintain PCB assembly processes including screen printing, placement, reflow, and automated optical inspection. Will be process owner for AOI equipment. Requires: BS Engineering Th
Career Center | faridabad, India | Engineering,Production,Quality Control
My technical proficiency is extensive and is summarized on my resume (attached). As reflected on my resume (attached) I have completed my B-tech this Year.I am a fresher Electronics Engineer but having 6 months of PCB Assembling,PCB Manufacturing and
Career Center | faridabad, India | Engineering,Production,Quality Control
My technical proficiency is extensive and is summarized on my resume (attached). As reflected on my resume (attached) I have completed my B-tech this Year.I am a fresher Electronics Engineer but having 6 months of PCB Assembling,PCB Manufacturing and
Lewis & Clark | https://www.lewis-clark.com/product-tag/double/
double Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal: $ 0.00 View Cart Checkout Lewis and Clark, Inc
KingFei SMT Tech | https://www.smtspare-parts.com/sale-11105127-panasonic-smt-smd-double-8mm-splicing-tape-esd-white-black-color.html
: SMT machine Part Number: DIP Pre-wave soldering AI AOI Voltage: 200V-230V AC 50/60HZ Power consumption: MAX560W Get Best Price Double-sided wave soldering 2D/3D AOI SMT Equipment 2D/3D AOI Part Name
