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SLIM KIC 2000 SPECIFICATIONS: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
Electronics Forum | Wed Feb 09 16:09:06 EST 2000 | Doug
Does anyone have any ideas on setting up a parts library/database on an SMT line? We would like to identify a particular part by it's package style, instead of by the customer's part number, in order to reduce the amount of entries in the library.
Electronics Forum | Sat Feb 18 09:20:09 EST 2012 | davef
The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedize
Industry News | 2013-06-07 15:36:04.0
GPD Global has signed a partnership agreement with Aegis Software to distribute CircuitCAM Express data translation software.
Industry News | 2020-10-03 08:34:38.0
MIRTEC is pleased to announce that Energy Conversion Applications (ECA), Inc., a full-service EMS provider specializing a full range of turnkey and hybrid solutions for PCB assembly including custom cables & harness, coil winding and complete box build assembly, has selected MIRTEC as their AOI partner with the purchase of an MV-3L Desktop AOI Machine.
Technical Library | 2019-06-06 13:40:47.0
Legacy electronics assemblies, such as through-hole (Figure 1) and connectorized component packages, are robust and prevalent throughout industry. However, each of these assembly methods have reached their limits in terms of weight, volume, reliability, and most importantly cost. With cost reduction of assemblies now the primary focus area throughout the electronics industry, there is more of a need than ever to implement the latest advancements in surface mount technology (SMT) into electronics assembly designs. Although SMT has been utilized in the electronics industry for many years, implementation of the technology is still in the ever-evolving process of reducing component footprint size, component spacing, and component I/O pitch. Implementation of the most up-to-date SMT processes provides optimal weight, volume, and cost savings, for any type of assembly.
Technical Library | 2013-07-03 10:31:54.0
It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality.
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
When It Comes to Cost Reduction, Variation and Waste are the Enemy News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! When It Comes to Cost Reduction, Variation and Waste
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