New Equipment | Education/Training
BEST SMT training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature 0.062in thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This SMT tra
New Equipment | Education/Training
BEST training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature ".062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This board feature
Electronics Forum | Wed Jun 15 08:45:25 EDT 2011 | edmaya33
check your reflow chain. it maybe vibrating causing DPAK to fall at second reflow.
Electronics Forum | Thu Aug 13 16:25:11 EDT 2015 | emeto
Loctite 3609. Just a small dot under the D-Pak and it works 100%.
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2011-02-26 14:53:15.0
Cree announces the availability of the industry's first commercial 1200-V surface-mount SiC Schottky diode. Packaged in an industry-standard surface-mount TO-252 D-Pak, the Schottky diodes deliver the same proven performance as Cree's TO-220 through-hole devices, with a smaller board footprint and lower profile.
Parts & Supplies | Assembly Accessories
3 PIN D-PAK(.403) TRACK ASSEMBLY GSM-Platfrom Compatible
BEST IPC J-STD-001 Revision F training kits feature REAL circuit boards that represent actual soldering conditions. This kit features "062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This
TI New and Original THS4281DBVR in Stock SOT-23-5, 2122+ THS4281DBVR Ultra Low Power, High Speed, Rail-to-Rail I/O, Voltage Feedback Operational Amplifier Today's Hot Deals： TCD2220 QFP Dice 12+ L9301-TR HSSOP36 ST 21+ CD4093BE DIP-14 TI
AATEC Ltd | https://aatec.ch/srv-tape-material.php
) We design customized pocket tape for any kind of components Home Tape & Reel material Standard components : DDPAK DPAK SOP PLCC QFP QFN TO252 TO263 SO SOS SOT223 SOT23 TSOP SOH SOJ SC70 SC75 LLP MLP BGA QFPH DFN HBGA SQFP VSO Capacitor Resistor Diodes Your partner in modular automation http://aatec.ch
Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf
– MIDAS Component range Chip (from 01005), SOIC, PLCC, TSOP, QFP, BGA, flip chip, odd- shape, surface-mount connectors, through-hole components, CSP, CCGA, DPAK, Alcap, Tantalum Component specification Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005) Max: 140 x 73 x 15 mm (5.51” x 2.87” x 0.59”) (1) Max: component weight: 140 g (2) (1) With 4K vision
