Industry Directory: dummy bga packages (57)

TopLine Dummy Components

Industry Directory | Manufacturer

TopLine has the widest selection of daisy chain test packages and practice boards. In stock CCGA, BGA, CSP, QFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Standard Systems

Industry Directory | Consultant / Service Provider / Manufacturer / Manufacturer's Representative

Dummy Components and IC Assembly/IC Packaging Service Provider

New SMT Equipment: dummy bga packages (173)

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

New Equipment | Software

ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc.  ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat

UNISOFT Corporation

BGA Rework Services

BGA Rework Services

New Equipment | Rework & Repair Services

BGA Rework Services Offered  BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

Electronics Forum: dummy bga packages (622)

underfilling of bga

Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude

Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P

underfilling of bga

Electronics Forum | Mon May 18 08:59:41 EDT 2009 | ozgurv

Dear All, Does anyone on the forum have experience with underfilling process of bga? We have a component with 0.5mm bga on one of the new products. Customer wants this component to have an underfill. Questions - 1) which kind of epoxy or chemica

Used SMT Equipment: dummy bga packages (40)

DEK Horizon 03i Printer

DEK Horizon 03i Printer

Used SMT Equipment | Screen Printers

DEK Horizon 03i automatic stencil printer Specification : DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Panasonic  NPM module

Panasonic NPM module

Used SMT Equipment | SMT Equipment

Product Name :Panasoinc  NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: dummy bga packages (550)

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Parts & Supplies: dummy bga packages (111)

Fuji FUJI QP3 NOZZLE

Fuji FUJI QP3 NOZZLE

Parts & Supplies | Component Packaging

FUJI QP3 NOZZLE: QP3     1.0     NOZZLE QP3     1.3     NOZZLE QP3     1.8     NOZZLE QP3     2.5     NOZZLE QP3     3.7     NOZZLE QP3     5.0     NOZZLE QP3     5.0G    NOZZLE QP3     8.0     NOZZLE QP3     8.0G    NOZZLE QP3     10.0G  

ZK Electronic Technology Co., Limited

Juki 2CH SERVO CONTROLLER 40044540

Juki 2CH SERVO CONTROLLER 40044540

Parts & Supplies | Pick and Place/Feeders

JUKI KE-1070 KE-1080 KE-3010 KE-3020 16AXIS 2CH SERVO CONTROLLER 40044540 Other juki parts: 40044531 MAGNETIC SCALE X SENSOR UNIT 40044532 MAGNETIC SCALE Y SENOR UNIT 40044533 SERVO MOTOR 10W HC-BH0336LW4-S4 40044534 SERVO MOTOR 30W 40044535 4A

ZK Electronic Technology Co., Limited

Technical Library: dummy bga packages (41)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Underfill Materials Dispensing in Electronics Manufacturing Applications

Technical Library | 2024-08-20 00:40:08.0

In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.

GPD Global

Videos: dummy bga packages (523)

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

Training Courses: dummy bga packages (7)

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

BGA Rework Training & Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: dummy bga packages (12)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA

SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework

Surface Mount Technology Association (SMTA)

Career Center - Jobs: dummy bga packages (13)

Advanced Manufacturing Technology Engineer

Career Center | Space Coast, Florida USA | Engineering,Research and Development

Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit

Priority Search

Engineer

Career Center | Boise, Idaho USA | Engineering

In need of a contract engineer ASAP!! This person will help with the fabrication of implantable medical devices. Incumbent must have electronic packaging and uBGA experience. The qualifications are below. This position will be from 3-9 months and nee

Vista Partners, Inc.

Career Center - Resumes: dummy bga packages (21)

rozenblit1

Career Center | , Israel | Engineering,Maintenance,Technical Support

I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr

SMT Manager having 10 yrs in Electronic Manufacturing.

Career Center | Cochin, Kerala India | Engineering,Management,Production,Technical Support

9 Years Experience in SMT Manufacturing Process, Quality Control Process, Testing and Engineering of Windmill power projects. The experience include: - � Skill in selection and installation of new manufacturing lines. � Conduct and analyze process t

Express Newsletter: dummy bga packages (747)

Partner Websites: dummy bga packages (395)


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