31 durapol peaks results

Pallet absorb thermal heat : compensate by higher deg-C?

Electronics Forum | Sat Jun 09 00:53:34 EDT 2001 | ianchan

Hi Folks, My Production runs a uBGA-liken product, and uses Pallets to support the 0.8mm thick pcb, during the SMT + reflow oven process. Process/QA see occurs: 1) 0402 unsolder? 2) 0402 tombstone? 3) "uBGA" poor-visual joints (dry joints)? Took