New SMT Equipment: dye pry bga inspection (4)

BGA Repair Service

BGA Repair Service

New Equipment | Rework & Repair Services

Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA

BEST Inc.

Bob Willis Online Training

Bob Willis Online Training

New Equipment | Education/Training

Our web based seminars represent an efficient way for you and your team to develop practical knowledge, delivering expert advice and guidance to you where, when and how you choose. Simple webinars offer a low cost and time efficient training option.

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Electronics Forum: dye pry bga inspection (24)

On site dye & pry equipment

Electronics Forum | Thu Feb 07 08:08:20 EST 2008 | scottp

We also use machinists dye. I like to pull a vacuum on the board after wicking the dye under the BGA. It seems to help fill fine cracks. I'll stick it in a warm oven if I'm in a hurry for the dye to dry. Then just bend the board to pop off the BGA.

On site dye & pry equipment

Electronics Forum | Wed Feb 06 09:40:05 EST 2008 | phouwen

We are experiencing some difficulty in BGA assembly and would like to do some periodic on site dye and pry after different assembly processes. Does anyone do this now? Is it actually feasible? Does anyone have recomendations on equipment/dye suppl

Industry News: dye pry bga inspection (31)

SMTA International Offers Cost Savings and Technical Excellence

Industry News | 2010-08-09 15:27:51.0

In an effort to accommodate companies recovering from the struggling economy, SMTA is offering valuable free events and cost-saving options for SMTA International attendees in addition to the strong technical conference for which they are renowned. The conference will be held at the Walt Disney World Swan and Dolphin Resort in Orlando, Florida on October 24-28, 2010.

Surface Mount Technology Association (SMTA)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Videos: dye pry bga inspection (2)

BGA Rework Service and Repair Services By BEST, Inc.

BGA Rework Service and Repair Services By BEST, Inc.

Videos

This video describes the BEST BGA rework and BGA rework services capabilities. What is described in this movie are the people, processes and tools unique to BEST and how that impacts its customers. The advanced equipment set including multiple refl

BEST Inc.

Adhesion Testing - How to Do it!

Adhesion Testing - How to Do it!

Videos

Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in

ASKbobwillis.com

Express Newsletter: dye pry bga inspection (865)


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INSPECTION TECH
INSPECTION TECH

Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.

Equipment Dealer / Broker / Auctions

Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea

Phone: +82-1029254936

PCB Handling with CE

High Throughput Reflow Oven
Fluid Dispensing, Staking, TIM, Solder Paste

World's Best Reflow Oven Customizable for Unique Applications
Selective soldering solutions with Jade soldering machine

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Electronics Equipment Consignment

Component Placement 101 Training Course
Electronic Solutions R3

Thermal Transfer Materials.