Company has extensive experience in operation, programming, preventative maintenance, repair, and operator training of Contact Systems CS400E, CS400D, and CS400C semi-automatic component assembly machines. Also, CS740BS, CS740BD and Quad testing.
Industry Directory | Consultant / Service Provider / Manufacturer
Service, installation, training, refurbishing of thru hole and SMT equipment, specializing in machines manufactured by Contact Systems
New Equipment | Coating Equipment
The SC-400 PreciseCoat® Conformal Coating Jet is ideal for applying coating materials to highly selective areas. This solution is designed for coating small substrates or substrates with high-component density, and when there are tight tolerances bet
Ersa HOTFLOW 3/20e SMT Reflow Oven Working width: 45-516 mm Process length: 4,840 mm Heated length: 3,725 mm Cooling length: 1,115 mm Weight appr. 1,900 kg Dimension: 6,265x1,201x1,375 mm Ersa HOTFLOW 3/20e SMT Reflow Oven Ersa HOTFLOW 3/20e S
Electronics Forum | Wed Sep 22 22:44:34 EDT 2004 | davef
We agree with Paul. If you prepare the components differently, so that they snap into place, you do not need to trim after wave. Most rotary trimmers put a HUGE amount of stress on solder connections, potentially cracking the connections. Some of
Electronics Forum | Mon Feb 25 11:29:55 EST 2013 | magellan
Has anyone had any experience in displaying PCX files on a CS400E?
Used SMT Equipment | Soldering - Wave
400V 50/60 HZ Version ERSAsoft for: 4.050.000.000 2. Operating System Dell / Windows 7 Processor: Pentium(R) Dual Core E5800 @ 3.20GHz 3.19GHz Memory RAM: 4.00 GB (3.46 GB usable) 320bit Operating System Touch Screen – No Pen Touch, input is availabl
Used SMT Equipment | SMT Equipment
Model :KE-2010 Mounter Placement speed：11000CPH Max PCB size :KE2010M,330mm/250mm；KE2010L,410mm/360mm；KE2010E,510mm/460mm Station:80 Component range :8mm-72mm Strip, bulk material Placement accuracy: CHIP ±0.08mm Power supply:three-phase 220V~3
Industry News | 2003-04-21 09:53:12.0
Michael T. O'Neill and Peter J. Simone
Industry News | 2003-05-30 08:36:25.0
Anticipates Savings Of $25 Million Per Year
Parts & Supplies | Other Equipment
JUKI FX-3/FX-3R Z motor HC-BH0336LW4-S1 30W PN 40048065 JUKI 2010 Z motor TS4633N2020E600 48V 30W E9629729000 JUKI 2010 T motor TS4632N2020E600 48V 20W JUKI 2010 X motor TS4509N2821E200 400W JUKI 2010 Y motor TS4515N2821E201 950W
Parts & Supplies | SMT Equipment
JUKI FX-1/FX-1R T motor HC-BH0136L-S14 10W 40068459 JUKI FX-1/FX-1R Y motor HC-MFS73(-S33) 750W JUKI FX-3/FX-3R Z motor HC-BH0336LW4-S1 30W PN 40048065 JUKI 2010 Z motor TS4633N2020E600 48V 30W E9629729000 JUKI 2010 T motor TS4632N2020E600 48
Technical Library | 2023-03-27 19:18:38.0
Electronic waste (e-waste) is currently the fastest growing hazardous waste stream that continues to be a challenging concern for the global environment and public health. The average useful life of electronic products has continued to decline, and obsolete products are being stored or discarded with increasing frequency. E-waste is hazardous, complex and expensive to treat in an environmentally sound manner. As a result, new challenges related to the management of e-waste have become apparent. Most electronic products contain a combination of hazardous materials, toxic materials, and valuable elements such as precious metals and rare earth elements. There are risks to human health associated with the disposal of E-waste in landfills, or treatment by incineration. Americans discard 400+ million electronic items per year recycling less than 20 percent in safe and sustainable manner. E-waste is exported from developed countries and processed informally using unsafe conditions in many regions of developing countries. A mixture of pollutants is released from these informal rudimentary operations. Exposure to e-waste recycling includes the dismantling of used electronics and the use of hydrometallurgical and pyrometallurgical processes, which emit toxic chemicals, to retrieve valuable components. Thermal analysis integrated with chromatographic and spectroscopic techniques are used to determine dangerous chemicals emitted during the burning of e-waste. The information is used to assess the risk of exposure of workers at these semi-formal recycling centers.
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
PV inverters require reliability against ingress humidity and dust in harsh environments, like deserts. Conformal coating is critical to protect inverter PCBA. Shown with the SC-400. http://www.nordsonasymtek.com
03037000-01 Guide rail 4 left side 03037001-01 Guide rail 5 left side 03037002-01 Guide rail 6 left side 03037017-01 RETRO FIT KIT KGT 20x12 03037268S01 CPU-Bg. SMP16-CPU076 650MHz 128MB 03037619-01 Silencer/Pneumatic System HS
Events Calendar | Thu Aug 22 00:00:00 EDT 2024 - Thu Aug 22 00:00:00 EDT 2024 | Prior Lake, Minnesota USA
Upper Midwest Chapter: 33rd Annual Golf Tournament
Events Calendar | Tue Jul 18 00:00:00 EDT 2023 - Tue Jul 18 00:00:00 EDT 2023 | Chippewa Falls, Wisconsin USA
UMW Chapter In-Person Event: PCB 101 Workshop and Tour at TTM Chippewa Falls
Career Center | chennai, India | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
Two years working in EMS(process and Equipment Engineer)
Career Center | Brookfield, ALL USA | Management,Production
Training and Qualifications Mil standards 464 Mil Standards 2000 ESD Training Cellular Manufacturing TQM Totally Quality Manufacturing ISO 9000 and 9001 IPC Standards, IPCA-610 IPC-J-STD-001E OSHA training LEAN Manufacturing, JIT (Just In T
SMTnet Express, May 29, 2014, Subscribers: 22783, Members: Companies: 13874, Users: 36243 Microspring Characterization and Flip-Chip Assembly Reliability B. Cheng, D. De Bruyker, C. Chua, K. Sahasrabuddhe, I. Shubin, J. E. Cunningham, Y. Luo, K. F
Heller Industries Inc. | https://hellerindustries.com/parts/58749901/
: Call Heller's Service Department: +1-973-377-6800 Ext 5 END GRILL ALTRATION 400? OPERATION E-Mail Us: Fields with * are required. Don't forget to learn about our new reflow oven
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