Industry Directory | Manufacturer
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
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New Equipment | Assembly Services
KINGSUN Cheapest & Most Economical SMT Full automatic Semi automaic led pcb production line Provider Successful Experience: 1. We provide the best full-line equipment solutions for customers in different industries.(such as : chip industry, consume
KS-2425Z4 desktop SMT pick and place machine is a current market fastest actual mounting speed, the most stable performance and the best quality equipment. With marble mounting platform, 4 Heads +56 Feeder stations in one take and stick, support pneu
Electronics Forum | Wed Jul 30 09:07:14 EDT 2008 | grics
Zestron's Vigon RC-101...Good with no clean
Electronics Forum | Mon Mar 06 11:00:13 EST 2006 | fredericksr
I was wonderin' if anyone has ever made their own eyewash solution and what potential safety concerns or violations this might cause. I'm certain that the eyewash solution manufacturers are laughing all the way to the bank. Can anyone recommend a c
Used SMT Equipment | Pick and Place/Feeders
Refurbished YAMAHA YV100XG SMT Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute accuracy (μ + 3σ): ± 0
Used SMT Equipment | Pick and Place/Feeders
JUKI FX-3 High Speed Modular Mounter Model FX-3 FX-1R(Conventional model kind) Placement speed (chip) Optimum 0.049Sec./chip(74,000CPH) 33,000CPH*2 （optimum condition） IPC9850 60,000 CPH 25,000 CPH Component size 0402(01005) ～□33.5mm (or dia
Industry News | 2019-09-12 22:51:52.0
Learn first-hand the experiences, challenges and solutions our leaders are taking to achieve truly smart manufacturing.
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Parts & Supplies | Assembly Accessories
Electronic Products Machinery SMT Spare Parts Original New FUJI Locator PM05EC1 For FUJI Pick and Place Machine Electronic Products Machinery FUJI Locator PM05EC1 Locator PM05EC1 For FUJI NXT Machine SMT FUJI NXT Pick and Place Machine Locator PM0
Parts & Supplies | Pick and Place/Feeders
JUKI 2070ATC SMC ejector SY3120-5M0E-C4-F1-X343 40002102 BANK CABLE F ASM 40002104 MTC I/F(L)CABLE ASM 40002105 MTC I/F(R)CABLE ASM 40002106 YL-FAN CABLE ASM 40002109 AWC DRV POWER CABLE ASM 40002112 BACK UP DRIVER FG CABLE ASM(EN) 40002114 AW
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
MIRTEC is pleased to announce that after an extensive evaluation BOSCH has selected MIRTEC’s 3D AOI Technology as the best solution to meet their ongoing quality initiatives. The evaluation process was exceedingly detailed and included a
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | IPC-A-610 Specialist (CIS) Recert.
The Certified IPC-A-610 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-A-610 Specialists.
Events Calendar | Wed Oct 02 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | Fremont, California USA
i4.0 Connect Forum
Events Calendar | Tue May 24 00:00:00 EDT 2022 - Tue May 24 00:00:00 EDT 2022 | Laurel, Maryland USA
SMTA Capital Chapter Expo - Advanced Manufacturing on Supply Chain Solutions
Career Center | , Czech Republic | Engineering
CLIENT - International technology products manufacturer with manufacturing (high mix and medium/high volume - broad range of manufacturing processes), in Brno, CZ ROLE - SMT Engineer provide technical support and guidance to an inexperienced SMT
Career Center | , | Engineering,Research and Development,Technical Support
For over 50 years, Emerson & Cuming has been designing and manufacturing high performance encapsulants, adhesives, and coatings for the automotive, telecommunications and electronic industries. Our expansive breadth of technologies combined with our
Career Center | GURGAON, India | Engineering,Quality Control,Research and Development
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Career Center | Quito, Ecuador | Sales/Marketing,Technical Support
Technical Sales (machinery, animal and plant protection products). Sales Forecast New Products (Bsss Diffusion Model).
| https://www.smtfactory.com/SMT-Solution-for-Underwater-Drone-id41287377.html
SMT Solution for Underwater Drone - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español Français Hrvatski Italiano magyar Nederlands Polski Português Pусский românesc Slovenščina Suomalainen Türk dili Tiếng Việt العربية فارسی עִברִית 한국어 日本語
ASCEN Technology | https://www.ascen.ltd/Blog/Solutio/159.html
Selective conformal coating processes solution-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB depaneling machine,pcb buffer conveyor from ASCEN technology Welcome to visit ASCEN | | | | | | | Cart
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, 30 China
Phone: +86-138-29839112
