1~6 layers, based film PI and PET, RA/ED Copper, Coverlay 0.50~2.0mil, Min. line/space +/-2mil, Outline by routing and laser cut. Sample lead time 5~7 days, mass production 10~14 days.
1~6 layers, based film PI and PET, RA/ED Copper, Coverlay 0.50~2.0mil, Min. line/space +/-2mil, Outline by routing and laser cut. Sample lead time 5~7 days, mass production 10~14 days.
Electronics Forum | Thu Jan 04 08:33:08 EST 2007 | davef
You cannot determine foil thickness from its weight per area, because of the significant variation in the density of electrodeposited [ED] copper. But people don't care. They do it regardless. (oz/ft2)||(mils)||(mm) 1/2||0.7||17.8 1||1.4||35.6 2||2
Electronics Forum | Fri Jun 09 10:01:39 EDT 2017 | jkitt84
Ed, this is great info. Thanks. Jeff
Industry News | 2011-03-01 16:38:55.0
Nihon Superior Co. Ltd. announces that Keith Sweatman, Senior Technical Advisor, will present a paper titled "The Stability Window and Mechanical Properties of the Interfacial Intermetallic in Lead-free Solder Joints" at the upcoming TMS 2011 Annual Meeting & Exhibition.
Industry News | 2017-07-19 21:09:38.0
STI Electronics is pleased to announce the acquisition of a new Fischerscope X-ray XDAL 237 energy dispersive X-ray fluorescence (EDXRF) system.
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Tg 170 + Rogers 4350B 2). 290*130mm/1up 3). 6 layers at 1.6mm thick 4). Green solder mask/White ident 5). 35um copper finished, ED copper. 6). Electroless gold. 7). Countersunk slots.
Technical Library | 2020-07-29 19:58:48.0
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis.
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ Brand GE Fanuc Series VersaMax Manufacturer GE Intelligent Platforms (Former); Emerson Automati
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
ORION Industries | http://orionindustries.com/pdfs/frfilm.pdf
. Flame retardant insulating film laminated to a conductive foil, such as copper or aluminium, allows creatively designed shields to be placed in close proximity to the emitting source, without fear of internal arcing
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, Ph.D, Sitaram Arkalgud, Ph.D, and Eric Tosaya Abstract 29-1 Effect of Gold and Copper on AuSn4 Deposition and Isothermal Durability of SAC305 Solder Joints Subhasis Mukherjee, Carlos Morillo, Lay-Ling Ong, Julie Silk, and
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