Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Consultant / Service Provider / Manufacturer / Standards Setting / Certification / Training Provider
Blackfox is the industry leader in providing IPC Certifications, Solder Training, Customized Training Programs, and Counterfeit Component Training and Certification.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Electronics Forum | Tue Mar 26 10:30:28 EDT 2019 | pavel_murtishev
Hello, Could you please tell me if there is any industry standard specifying QFN to PCB standoff after soldering? Is any gap allowed? Browsing IPC-A-610, I have found nothing. Any input would be appreciated. Regards
Electronics Forum | Thu Mar 28 13:38:35 EDT 2019 | pavel_murtishev
Davef, Thank you for the comprehensive reply. I do really appreciate your help. Regards
Used SMT Equipment | Pick and Place/Feeders
Refurbished YAMAHA YV100XG SMT Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute accuracy (μ + 3σ): ± 0
Used SMT Equipment | Pick and Place/Feeders
CP45FV NEO Popular CP45FV NEO. Highly Flexible, user friendly machine and highly reliable. Full vision with 6 placement heads, each with individual illumination allowing 6 totally different components to be aligned on the fly. Upward looking
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Parts & Supplies | Pick and Place/Feeders
N610108741AA ONE BOARD MICRO CM402 motor supply: CM402 Y-axis motor KXF0CWLAA00 CM402 X-axis motor N510005279AA CM402 Z-axis motor (standard type) N510042738AA/KXF0CWQAA00 CM402 Z-axis motor (lightweight) N510042737AA CM402 & CM602 Feida Feed
Parts & Supplies | Pick and Place/Feeders
Long board SMT Placement Machine JX-350 Chip 32,000CPH chip (Laser centering/Optimum) 21,000CPH chip (Laser centering / IPC9850) ■ From 0603 to □33.5mmsquare components ■ JUKI laser centering for high spe
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2022-06-27 17:04:51.0
In today's Electronics Manufacturing Industry, standards for defect and quality control are stricter than ever due to advancements of electronic products and increasing safety and environmental regulations. Electronics Manufacturers are forced to maximize their production efficiency by implementing lean manufacturing initiatives and optimizing production processes. With this in mind, manufacturers are relying upon Automated Optical Inspection (AOI) equipment to streamline the manufacturing process and provide real time root cause analysis of manufacturing defects. The objective is to increase profitability by improving production yields and reducing costly rework.
Nano-copper sintering in formic acid vapor.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Events Calendar | Thu Dec 05 00:00:00 EST 2019 - Thu Dec 05 00:00:00 EST 2019 | ,
Webinar: Update on New IPC-1752B Supply Chain Standard — Preparing for Submissions to the ECHA SCIP Database
Events Calendar | Sat Jun 15 00:00:00 EDT 2019 - Thu Jun 20 00:00:00 EDT 2019 | Raleigh, North Carolina USA
IPC SummerCom
Career Center | San Diego, California USA | Engineering,Management,Production
Customer interaction, inventory and delivery of Stencils. In charge of the Satellite Operation in San Diego, Ca. Report to Headquarters in Lake Forest, Ca. Duties and responsibilities: Take full responsibility for the Satellite Operation facility.
Career Center | Dallas, Texas USA | Engineering
Responsibilities:Development and maintenance od a standardized product routing structure. Development and maintenance of product time standards. Evaluation, improvement and maintenance of the engineering quotation process for new products. Develop
Career Center | Raymond, USA | Engineering,Maintenance,Management,Production,Technical Support
Expert knowledge of circuit board manufacturing for the through-hole and Surface Mount Technology industry, international and national field work to manufacturers. Provided high value technical assistance and formal training to industry standards. Sp
Career Center | Moline, USA | Management,Production,Technical Support
Numerous years experience developing complete manufacturing processes for electronic assemblies.
| https://www.eptac.com/webinars/ipceia-j-std-001-by-the-numbers-understanding-the-key-supporting-documents/
IPC/EIA J-STD-001 by the Numbers: Understanding the Key Supporting Documents - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull
. Representing the best-in-class, the 4000Plus bondtester sets the industry standard in bond testing offering… 4000HS High Speed Bondtester The Nordson DAGE 4000HS bondtester is based upon the industry standard Nordson DAGE 4000 multi-purpose bondtester platform
