Industry Directory | Manufacturer
Manufacturer of Screen Printers for the Electronics Industry. ASYS Inc. and EKRA Americas Inc. merged under the name of ASYS Group Americas Inc. in 2010.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Technical parameter： Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
Electronics Forum | Mon Sep 29 15:28:29 EDT 2014 | dustin
After getting the last issue I had fixed through here. I thought I would try to see if there is a solution for another issue. I have and ekra e5 screen printer and it has a problem with the blades not dropping when they should. If I set up single dir
Electronics Forum | Mon Feb 20 20:47:59 EST 2006 | davef
We assume your stencil is clean. So, try: * Reduce stencil separation speed. * Reduce squeegee pressure. If the pressure is not proper, excess number of particles are stuffed into an aperture and inner pressure / friction among particles increase, an
Used SMT Equipment | Screen Printers
MPM UP2000HiE PRINTER Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps) Thickness rang
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Industry News | 2003-06-16 08:33:59.0
This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Parts & Supplies | SMT Equipment
MPM AP series about squeegee pressure Name: P1666; MPMAP series about squeegee pressure control card Part Number: P1666 Description: P1666; MPM AP series about squeegee pressure control card Applicable models: UP; AP Printing Presses P1666;
Parts & Supplies | Screen Printers
Name: P1827 MPM air pressure sensor; MPM APS air pressure switch Part Number: P1827 MPM APS sensor Description: P1827 MPM air pressure sensor; MPM APS air pressure switch; MPM APS sensor; Module, Pneum Electric, Pressure Switch Applicable mod
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Fort Lauderdale, Florida USA | Production
About Us URtech Manufacturing is a North American provider of end-to-end Electronic Manufacturing Services (EMS) to OEMs since 2010. Our services extend from product concept to commercialization, supporting the entire product life cycle. We build
Career Center | Gardena, California USA | Engineering
Qual-Pro Corporation provides electronic manufacturing solutions to multiple industries including aerospace, defense, ISR, medical, and precision industrial controls. Our company offers a challenging and rewarding environment with a tremendous opport
Career Center | , | Engineering,Maintenance,Technical Support
Dear Sir/Madam, I am having the 10 years exprience in SMT field. Currently I am working in Service industry as Senior Engineer. Specially I am exprience and trained in FUJI and Speedline machines. Earlier I worked with Manufacturing Industry.
Career Center | Poway, California USA | Engineering,Production
Technically qualified in proper operation, troubleshooting, installation /dismantling, programming and preventive maintenance of SMT (Surface Mount Technology) machines. Productivity and quality for the production of PCBA (Printed Circuit Board Ass
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/printing-publishing-and-graphic-arts?con=t&page=36
Print Finishing Solutions | Nordson Nordson Corporation Global Directory | Languages NASDAQ $230.50 -0.49 Our Products Our Industries Our Applications Brands
Lewis & Clark | http://www.lewis-clark.com/product-tag/ekra/
: USA / FOB Origin Availability: Immediate for purchase / 2-4 weeks for shipping EKRA X5 Screen Printer- 2006 Make: EKRA Model: X5 Vintage: 2006 Details: 2 ½D Inspection Programmable Print Head Vacuum Wiper Adjustable Stencil Rails Condition
