Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
JT Reflow Oven KT series JT Reflow Oven Reflow Oven KT series Name: SMT Reflow Oven Heating zones: 8 10 12 JT Reflow Oven KT series Usage: SMT Assembly line Product description: JT Reflow Oven KT series:KTD-0804/KTD-0804-N, KTD-1004/KTD-100
Used SMT Equipment | Conveyors
PROMATION SPRING INVENTORY CLEARANCE TRADE SHOW UNITS Model: ESL and ESU- 700 SL MULTIPLE MAGAZINE LINE LOADER & UNLOADER SET Configuration: In-Line Configuration with in-line buffer (1730 mm L x 870 mm D) Frame Style: Pr
Used SMT Equipment | Semiconductor & Solar
BTU Atmosphere Belt Furnace w/ Muffle VMCA62-13-117N36 Max Temp: 1100ºC Vintage: 2001 Electrics: 240 volts 3 Ph 40kVA 99 A 50/60Hz 13 Zones 6” Belt – 2” Clearance Overall Dims: 23 feet long x 31 i
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2018-10-18 11:13:35.0
PCB Outline Layer And Keep-out Polygon Clearance
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
Career Center | Lancaster, Pennsylvania USA | Engineering
Provide leadership to the engineering staff and manage, initiation and completion of all engineering deliverables. Deal with customers, business associates, program managers, manufacturing, planning, marketing and purchasing. Requires extensive kno
Career Center | Charleston, South Carolina USA | Engineering,Maintenance,Production,Quality Control,Technical Support
UEC serves the aerospace, military, industrial, and commercial markets by providing comprehensive product design, system integration, and vertically integrated manufacturing solutions including: hardware, software, and mechanical engineering; rapid
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Per the IPC-A-610 , a PCB with more than 5 solder balls (<=0.13mm) within 600mm² is defective, as a diameter larger than 0.13mm violates the minimum electrical clearance principle
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