Industry Directory: electroless (4)

Remtec, Inc.

Industry Directory | Manufacturer

US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).

Pandawill Technology Co.,Ltd

Industry Directory | Consultant / Service Provider / Manufacturer

Pandawill Circuits manufacture and supply a wide range of high quality PCB technologies, volumes, cost and manufacturing lead-time options based on our fundamental understanding of the PCB manufacture

New SMT Equipment: electroless (12)

Lead Free Mixed Technologies Training Kit

Lead Free Mixed Technologies Training Kit

New Equipment | Education/Training

BEST training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature ".062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This board feature

BEST Inc.

PCB Final Finishes - Electroless Nickel Immersion Gold (ENIG, ENEPIG) Immersion Silver, Immersion Tin

PCB Final Finishes - Electroless Nickel Immersion Gold (ENIG, ENEPIG) Immersion Silver, Immersion Tin

New Equipment | Surface Finish

Technic supplies precious metal and tin and tin alloyed products that are used to preserve as well as enhance soldering and bonding through all levels of interconnection. Technic is well established as a leader in Final Finish Solutions for printed

Technic Inc.

Electronics Forum: electroless (178)

Electroless Nickel without gold immersion

Electronics Forum | Tue Aug 20 14:55:33 EDT 2002 | markhoch

Has anybody expierianced solderability issues on electroless nickel boards that do not have gold immersion? We recently tried to process boards of this type, and I may as well have been trying to reflow on plastic. Any ideas?

Brd(Electroylic Gold finishing) got blisters

Electronics Forum | Wed Aug 24 08:50:59 EDT 2005 | davef

First, while black pad can be a problem with poorly controlled electroless gold [search SMTnet Archives for background], it is not a suffiecient reason to use electrolytic. It's the reason the supplier should fix their electroless gold process. Se

Industry News: electroless (30)

Frigid Climate, Industry Can't Stop Some from UIC Seminar

Industry News | 2003-02-07 09:13:12.0

The Sessions Covered Current and Emerging Technologies

SMTnet

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: electroless (1)

BICHENG Mixed material PCB

BICHENG Mixed material PCB

Parts & Supplies | Circuit Board Assembly Products

1). FR-4 Tg 170 + Rogers 4350B 2). 290*130mm/1up 3). 6 layers at 1.6mm thick 4). Green solder mask/White ident 5). 35um copper finished, ED copper. 6). Electroless gold. 7). Countersunk slots.

Bicheng Enterprise Company

Technical Library: electroless (29)

Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers

Technical Library | 2012-10-11 19:50:09.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper shows the benefits by using a pure palladium Layer in the ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) and ENEP (Electroless Nickel, Electroless P

Atotech

Study of Various PCBA Surface Finishes

Technical Library | 2015-11-25 14:15:12.0

In this study various printed circuit board surface finishes were evaluated, including: organic solderability preservative (OSP), plasma finish (PF), immersion silver (IAg), electroless nickel / immersion silver (ENIS), electroless nickel / immersion gold hi-phosphorus (ENIG Hi-P), and electroless nickel / electroless palladium / immersion gold (ENEPIG). To verify the performance of PF as a post-treatment option, it was added to IAg, ENIG Hi-P, and ENEPIG to compare with non-treated. A total of nine groups of PCB were evaluated. Each group contains 30 boards, with the exception on ENIS where only 8 boards were available.

Flex (Flextronics International)

Events Calendar: electroless (2)

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Surface Mount Technology Association (SMTA)

Qualification and Reliability of Microvias

Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,

Qualification and Reliability of Microvias

CALCE Center for Advanced Life Cycle Engineering

Express Newsletter: electroless (27)

Partner Websites: electroless (27)

Dispense Flow and Control Optimized

GPD Global | https://www.gpd-global.com/co_website/pdf/pump/S-Type-Nozzles.pdf

0.002”, 0.004”, & 0.006” I.D.s see above see above 22110499 K E Y: * PB with EN = Phosphor Bronze with Electroless Nickle † NS with EN = Nickle Silver with Electroless Nickle

GPD Global

Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly

board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating


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