Electronics Forum: electroless 2.plating (1)

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI

We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The

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Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly

board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating

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