Electronics Forum | Thu Jun 22 10:42:39 EDT 2017 | emeto
Guys I didn't mention that the electrolytic caps are SMT.
Electronics Forum | Tue Jun 29 14:55:22 EDT 2010 | rgduval
For the capacitors that Yageo analyzed... Were they taken out at representative points in the process?? ie. were samples taken from pre-assembly, pre-ICT, post-conformal coat, post-final test? You note that the parts 'seem' to be ok up to ICT. And
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
Industry News | 2018-10-18 10:28:01.0
The Future of Embedded Passive Components
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Career Center | , | 2013-01-31 04:29:34.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
Career Center | , | 2013-01-31 04:45:28.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
Laser Solder Reflow: A Process Solution, Part 2 Laser Solder Reflow: A Process Solution, Part II EFD, Inc Credit/Source: John Vivari - EFD, Inc. Alex Kasman - LEISTER Technologies LLC EFD Inc. and Leister USA have collaborated to bust
SMTnet Express, June 24, 2021, Subscribers: 26,990, Companies: 11,385, Users: 26,722 Filling of Microvias and Through Holes by Electrolytic Copper Plating — Current Status and Future Outlook The electronics industry is further
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12th, 2015 Minor revisions to correct reported issues including those related to error checking on the "Checker" and “Smelter List” tabs. This version incorporates a few changes to the smelter list as reflected in the Standard Smelter List as of June 12
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