Electronics Forum | Fri Apr 04 15:39:27 EDT 2014 | davef
I’m not going to do your job for you. Here are some links to get you started: * http://www.fda.gov/ICECI/Inspections/InspectionGuides/InspectionTechnicalGuides/ucm081273.htm * http://www.instructables.com/answers/how-to-identify-the-leakage-of-elect
Electronics Forum | Tue Nov 14 08:17:09 EST 2006 | Rob
Degassing - the air in the void above the electrolyte expands, or in some cases the electrolyte vapourises, blowing the top of the cap from the base. Sometimes electrolyte can also leak out around the base seal. This is also a failure as the cap wo
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Technical Library | 2009-10-14 21:17:47.0
Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias. ECM, also known as dendritic growth, is a critical issue in the electronics industry because the intermittent failure behavior of ECM is a likely root-cause of the high occurrence of field failures identified as no trouble found (NTF)/could not duplicate (CND)
Technical Library | 2014-08-07 15:13:44.0
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.
SMTnet Express, March 12, 2020, Subscribers: 34,796, Companies: 10,981, Users: 25,688 Filling of Microvias and Through Holes by Electrolytic Copper Plating – Current Status and Future Outlook Credits: Atotech The electronics industry is further
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/questions-answers_forum34&OB=asc_page14.html
:18pm Dome Switch Padstack creation By kowalski22 , 19 Dec 2014 at 7:33am 1 413 By Tom H 19 Dec 2014 at 9:03am Failure running Eagle script By SteveD , 23 Dec 2014 at 6
GPD Global | https://www.gpd-global.com/co_website/pdf/pump/Phosphors-LED.pdf
. Of the various components and materials inside a typical LED bulb, phosphors exhibit the longest lifetime. Rather than any malfunctioning of the LED itself, most bulbs fail prematurely because of the failure of one or more electronic components, such as electrolytic capacitors, in their power supply
