Industry Directory: electronic packages (278)

Winsmart Electronic Co.,Ltd

Winsmart Electronic Co.,Ltd

Industry Directory | Manufacturer

Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.

Whizz Systems

Whizz Systems

Industry Directory | Consultant / Service Provider / Manufacturer

Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.

New SMT Equipment: electronic packages (166)

Precision Lead Former for Axial Components (CF-8)

Precision Lead Former for Axial Components (CF-8)

New Equipment | Lead Forming

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global

Unisoft ProntoSELECTIVE-SOLDERING software

Unisoft ProntoSELECTIVE-SOLDERING software

New Equipment | Software

ProntoSELECTIVE-SOLDERING is used by electronic manufacturers to quickly program their Selective Soldering machines.   ProntoSELECTIVE-SOLDERING helps program most popular Selective Soldering machines such as ACE Production Technologies, RPS Autom

UNISOFT Corporation

Electronics Forum: electronic packages (2879)

humidity in PC packages

Electronics Forum | Mon Jun 21 15:00:41 EDT 1999 | jgodfrey

I am finding that some of our IC's are coming from the supplier with the humidity gauge in the bag reading 10-20%. Has anybody done any tests to determine what humidty level in a package will cause problems during reflow?

SMT layout for multiple packages

Electronics Forum | Fri Apr 27 11:26:53 EDT 2001 | pteerink

Check out IPC SM-785 Land pattern guidelines for SMT www.ipc.org Phil

Used SMT Equipment: electronic packages (20)

DEK Horizon 03i Printer

DEK Horizon 03i Printer

Used SMT Equipment | Screen Printers

DEK Horizon 03i automatic stencil printer Specification : DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DEK Galaxy APi

DEK Galaxy APi

Used SMT Equipment | Screen Printers

Very nice DEK Galaxy Ball Mount For Sale The machine is in excellent working condition and was just taken out of an Electronics company which went out of business! See attached pictures and information below Equipment Description DEK Type: B

1st Place Machinery Inc.

Industry News: electronic packages (4603)

Heller Industries Opens New Office and Demo Center in Taoyuan, Taiwan

Industry News | 2023-03-30 22:45:02.0

Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.

Heller Industries Inc.

HELLER Mainstay, Don DeAngelo Retires On 70th Birthday

Industry News | 2024-06-21 17:26:01.0

Don DeAngelo, Vice President of Sales at Heller Industries, and a stalwart in the SMT industry, has retired. Don joined Heller Industries in July 1984 and guided Heller's Eastern US sales efforts through the transition from lead forming equipment to reflow ovens in the 1980s.

Heller Industries Inc.

Parts & Supplies: electronic packages (313)

Juki JUKI KE2080 Electronic Feeder

Juki JUKI KE2080 Electronic Feeder

Parts & Supplies | Pick and Place/Feeders

JUKI KE2080 Electronic Feeder ARD-JK-08 1.Quality and package:Each part is checked and tested strictly by our professional QC, make sure each product is in good quality and working condition. Meanwhile each package would be well packed and protecte

Qinyi Electronics Co.,Ltd

Fuji XPF Upper Cover 2AGGHB001005 2AGGHB002305 Cover 2AGGHB002304

Fuji XPF Upper Cover 2AGGHB001005 2AGGHB002305 Cover 2AGGHB002304

Parts & Supplies | Pick and Place/Feeders

FUJI XPF Upper Cover 2AGGHB001005 2AGGHB002305 Cover 2AGGHB002304 original new in stock Other parts we have: NXT (first generation / second generation /) original brand new V12 H12HS H12S H08 HEAD original brand new NOZZLE! ! NXT 0.4mm 0.5mm 0.7mm

ZK Electronic Technology Co., Limited

Technical Library: electronic packages (125)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Technical Library | 2023-01-17 17:12:33.0

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.

Heller Industries Inc.

Videos: electronic packages (683)

Precision Lead Former for Axial Components (CF8)

Precision Lead Former for Axial Components (CF8)

Videos

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global

Example of how to import CAD data and BOM files, and export to an AOI machine program setup file.

Example of how to import CAD data and BOM files, and export to an AOI machine program setup file.

Videos

www.unisoft-cim.com/prontoaoi.htm - ProntoAOI software from Unisoft is used by electronic manufacturers to quickly program their Automatic Optical Inspection (AOI) machines and X-RAY Equipment. ProntoAOI programs most popular AOI Equipment such as

UNISOFT Corporation

Training Courses: electronic packages (10)

Counterfeit Component Prevention Training Course

Training Courses | | | Other Courses

Other courses related to electronics manufacturing and assembly

Blackfox Training Institute, LLC

Component Indentification Certification

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

EPTAC Corporation

Events Calendar: electronic packages (57)

Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial

Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,

Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial

Surface Mount Technology Association (SMTA)

Optimizing Conformal Coating Coverage for Improved Environmental Corrosion Protection - Free Webinar

Events Calendar | Fri Mar 27 00:00:00 EDT 2020 - Fri Mar 27 00:00:00 EDT 2020 | ,

Optimizing Conformal Coating Coverage for Improved Environmental Corrosion Protection - Free Webinar

Surface Mount Technology Association (SMTA)

Career Center - Jobs: electronic packages (146)

Commission Sales

Career Center | All, China | Sales/Marketing

Looking for a commission based sales representative to sell SMTnet.com Advertising services in Asia, Europe, USA.   The candidate should be familiar with the electronics manufacturing industry.  Please view our marketing packages at: http://www.s

SMTnet

SMT Engineer - electronic manufacturing

Career Center | , Czech Republic | Engineering

CLIENT - International technology products manufacturer with manufacturing (high mix and medium/high volume - broad range of manufacturing processes), in Brno, CZ ROLE - SMT Engineer provide technical support and guidance to an inexperienced SMT

Solutions Driven ltd.

Career Center - Resumes: electronic packages (52)

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

smt maintenance specialist

Career Center | , | Maintenance

Specialized in Siemens equipment, and OmniExcel 7, MPM Ap25, Momentum.

Express Newsletter: electronic packages (1116)

Partner Websites: electronic packages (325)

Nordson DAGE to Launch New 4800 Wafer Level Bondtester at SEMICON West

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-to-launch-new-4800-wafer-level-bondtester-at-semicon-west

microcircuits or automotive electronic packages.  Additionally, Nordson DAGE’s X-Plane™ and CT options will be demonstrated at the show.  X-Plane™ uses a proprietary, patent applied for, tomosynthesis, or CT technique to create 2D X-ray slices in any plane of a printed circuit board assembly

ASYMTEK Products | Nordson Electronics Solutions

IPC Training Center Component Series by Blackfox

Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/operator-component-series/

surface mount components that are used in electronic assembly. The student will gain introductory knowledge on major through hole and surface mount component packages and their reference designators, markings, orientation, and polarity.   TOPICS COVERED

Blackfox Training Institute, LLC


electronic packages searches for Companies, Equipment, Machines, Suppliers & Information

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Winsmart Electronic Co.,Ltd
Winsmart Electronic Co.,Ltd

Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.

Manufacturer

Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, 30 China

Phone: +86-138-29839112

Online Equipment Auction of Altronic: Small-Batch Surface Mount & Assembly Facility

High Precision Fluid Dispensers
Void Free Reflow Soldering

High Throughput Reflow Oven
PCB Handling with CE

World's Best Reflow Oven Customizable for Unique Applications


SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...