Industry Directory | Manufacturer
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
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New Equipment | Assembly Services
KINGSUN Cheapest & Most Economical SMT Full automatic Semi automaic led pcb production line Provider Successful Experience: 1. We provide the best full-line equipment solutions for customers in different industries.(such as : chip industry, consume
KS-2425Z4 desktop SMT pick and place machine is a current market fastest actual mounting speed, the most stable performance and the best quality equipment. With marble mounting platform, 4 Heads +56 Feeder stations in one take and stick, support pneu
Electronics Forum | Thu Sep 26 12:53:31 EDT 2013 | markhoch
I'm not sure where you're located, but you should try contacting your Regional Sales Rep for ECD or KIC Thermal. They often times have demo units that they are required to "demo" several times per year. They may be willing to come in and profile your
Electronics Forum | Thu Sep 26 12:53:56 EDT 2013 | markhoch
I'm not sure where you're located, but you should try contacting your Regional Sales Rep for ECD or KIC Thermal. They often times have demo units that they are required to "demo" several times per year. They may be willing to come in and profile your
Used SMT Equipment | Pick and Place/Feeders
Refurbished YAMAHA YV100XG SMT Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute accuracy (μ + 3σ): ± 0
Used SMT Equipment | Pick and Place/Feeders
JUKI FX-3 High Speed Modular Mounter Model FX-3 FX-1R(Conventional model kind) Placement speed (chip) Optimum 0.049Sec./chip(74,000CPH) 33,000CPH*2 （optimum condition） IPC9850 60,000 CPH 25,000 CPH Component size 0402(01005) ～□33.5mm (or dia
Industry News | 2025-12-15 11:02:26.0
Heller Industries becomes the latest partner to join THE SMT FUTURE EXPERIENCE, bringing reflow oven expertise to complete the technology chain for the venue's live SMT production line. With Heller now alongside founding partners Fuji America, Koh Young, and Creative Electron, the San Marcos, California venue can demonstrate fully integrated manufacturing processes from screen printing and placement through thermal processing to final inspection and verification.
Industry News | 2025-12-05 00:44:42.0
At Productronica Munich 2025, Heller Industries showcased how strategic partnerships accelerate innovation in electronics manufacturing.
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Parts & Supplies | Pick and Place/Feeders
lable feeder for CM402 CM602 NPM original New We provide CM602/CM402/NPM Feeder, 4mm- 108mm and lable feeder , original new ,delivery fast. ZK company provide all kinds of Panasonic spare parts and solutions, if your have any problem
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
MIRTEC is pleased to announce that after an extensive evaluation BOSCH has selected MIRTEC’s 3D AOI Technology as the best solution to meet their ongoing quality initiatives. The evaluation process was exceedingly detailed and included a
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS) Recert.
The Certified IPC/WHMA-A-620 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC/WHMA-A-620 Specialist.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Events Calendar | Wed Jun 22 00:00:00 EDT 2022 - Wed Jun 22 00:00:00 EDT 2022 | ,
Empire Chapter Webinar: LIVE Action Reflow Focused Process
Career Center | , Czech Republic | Engineering
CLIENT - International technology products manufacturer with manufacturing (high mix and medium/high volume - broad range of manufacturing processes), in Brno, CZ ROLE - SMT Engineer provide technical support and guidance to an inexperienced SMT
Career Center | Anaheim, California USA | Engineering
Required Skills: 7 to 10 years� experience with the electrical and mechanical design and / or oversight of power converters, power supplies or related products requiring magnetic devices for functionality. Demonstrated experience in the development
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | Karachi, Pakistan | Engineering,Maintenance,Research and Development,Sales/Marketing,Technical Support
• Experienced in SMT Production, working on Siplace X Series-S and DEK-Micron Printer, on Siplace Pro and Siplace Explorer. • Having Strongly Skills of calibration of SMT machine, twin head, Multi star head, speed star head, gentry, Nozzles, feeders,
SMTnet Express, Octomer 15, 2020, Subscribers: 28,116 , Companies: 11,144, Users: 26,166 Fracture Toughness Of Thermally Conductive Adhesives Credits: Henkel Electronic Materials Thermally conductive adhesives provide many advantages
Optimizing Thermal & Mechanical Performance in PCBs Optimizing thermal and mechanical performance in PCBs Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn
ORION Industries | http://orionindustries.com/pdfs/thermal.pdf
. If you have a thermal transfer application, ORION will provide you with the highest quality, most cost effective solution. ORION is a registered trademark of Orion Industries Incorporated
| https://www.smtfactory.com/SMT-Solution-for-Underwater-Drone-id41287377.html
& Events As a global intelligent equipment provider, I.C.T has continued to provide intelligent electronic equipment for global customers since 2012
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, 30 China
Phone: +86-138-29839112
