Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
New Equipment | Rework & Repair Equipment
Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a
Electronics Forum | Mon Feb 16 15:01:21 UTC 2026 | SMTA-64414785
I realize that this is an old request, but there are lots of issues with this, so I’ll try to answer the question and hope it is a learning experience for others. First – there is no indication of the location so if someone was willing to help they
Used SMT Equipment | Pick and Place/Feeders
Refurbished YAMAHA YV100XG SMT Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute accuracy (μ + 3σ): ± 0
Used SMT Equipment | Pick and Place/Feeders
JUKI FX-3 High Speed Modular Mounter Model FX-3 FX-1R(Conventional model kind) Placement speed (chip) Optimum 0.049Sec./chip(74,000CPH) 33,000CPH*2 （optimum condition） IPC9850 60,000 CPH 25,000 CPH Component size 0402(01005) ～□33.5mm (or dia
Industry News | 2024-06-21 17:26:01.0
Don DeAngelo, Vice President of Sales at Heller Industries, and a stalwart in the SMT industry, has retired. Don joined Heller Industries in July 1984 and guided Heller's Eastern US sales efforts through the transition from lead forming equipment to reflow ovens in the 1980s.
Industry News | 2024-06-06 21:18:44.0
Heller Industries announced two hirings today to strengthen their market position in the Eastern United States. Bob Doetzer, President of Circuit Technology Inc., has been appointed sales representative for North and South Carolina. Circuit Technology is a manufacturer's representative and IPC training group specializing in products and services covering circuit board production and semiconductor assembly.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS) Recert.
The Certified IPC/WHMA-A-620 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC/WHMA-A-620 Specialist.
Events Calendar | Tue Oct 19 18:30:00 UTC 2021 - Tue Oct 19 18:30:00 UTC 2021 | ,
Penang Chapter Virtual Vendor & Technical Day
Events Calendar | Tue Jun 21 18:30:00 UTC 2022 - Tue Jun 21 18:30:00 UTC 2022 | ,
Empire Chapter Webinar: LIVE Action Reflow Focused Process
Career Center | Anaheim, California USA | Engineering
Required Skills: 7 to 10 years� experience with the electrical and mechanical design and / or oversight of power converters, power supplies or related products requiring magnetic devices for functionality. Demonstrated experience in the development
Career Center | , Texas USA | Engineering,Maintenance,Production,Technical Support
Rehm USA LLC sells and services thermal processing equipment for the electronics manufacturing industry. As part of Rehm Anlagenbau GmbH, Rehm USA extends the Rehm product line to the North America market and provides the highest quality service. Jo
Career Center | Meridian, Mississippi USA | Engineering,Management,Production,Quality Control
My skills include expertise in all electronic manufacturing processes including SMT and ATE; advanced experience with multiple MRP/MRPII/ERP applications utilizing both Windows and Unix operating systems; ISO9000 Standards compliance and registration
Career Center | Stoneham, | Engineering,Production,Research and Development,Technical Support
Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic
SMTnet Express, Octomer 15, 2020, Subscribers: 28,116 , Companies: 11,144, Users: 26,166 Fracture Toughness Of Thermally Conductive Adhesives Credits: Henkel Electronic Materials Thermally conductive adhesives provide many advantages
Optimizing Thermal & Mechanical Performance in PCBs Optimizing thermal and mechanical performance in PCBs Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn
ORION Industries | http://orionindustries.com/pdfs/thermal.pdf
. If you have a thermal transfer application, ORION will provide you with the highest quality, most cost effective solution. ORION is a registered trademark of Orion Industries Incorporated
| https://www.smtfactory.com/SMT-Solution-for-Underwater-Drone-id41287377.html
& Events As a global intelligent equipment provider, I.C.T has continued to provide intelligent electronic equipment for global customers since 2012
