Industry Directory | Other / Consultant / Service Provider / Manufacturer
ScanCAD is an industry leader in inspection, measurement, process control and reverse engineering. Our solutions support OEM's, manufacturers, stencil fabricators, repair depots, and others in optimizing quality and yield.
Industry Directory | Equipment Dealer / Broker / Auctions
Capital Equipment Solutions - SMT | PCBA | TEST
New Equipment | Rework & Repair Equipment
Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Used SMT Equipment | AOI / Automated Optical Inspection
Make: Mirtec Model: MV-7 OMNI Year: 2020 Type: 3D AOI Specifications: Fully Functional LIKE NEW - Mirtec Reconditioned June 2024 Exclusive 15MP/25MP CoaXPress Camera System OMNI-VISI
Used SMT Equipment | SPI / Solder Paste Inspection
Key Features Unmatched Inspection Speed with Guaranteed Best Accuracy The KY8030-3 blends Koh Young’s pioneering technologies with an inspection speed of 91.2 cm2/sec. The combination of this system’s throughput and accuracy makes the KY8030-
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
These are the instructions for the BEST Heatshields(TM) an effective, high tech simple way to shield heat sensitive components during reflow/rework. This ceramic-based non-woven material, when properly deployed, will protect components so that they d
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Events Calendar | Wed Apr 07 18:30:00 UTC 2021 - Wed Apr 07 18:30:00 UTC 2021 | ,
Huntsville Chapter Technical Meeting: Evaluating Conformal Coatings
Events Calendar | Tue Jul 18 18:30:00 UTC 2023 - Tue Jul 18 18:30:00 UTC 2023 | ,
SMTA Webinar: Secure, Intelligent, Detailed Design Data Exchange Between Design & Manufacturing
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | San Jose, Canillo | Production
Looking for an experienced sprayer of acrylics, polyurethanes, silicones & epoxies. Experience with HVLP equipment, mixing of materials (by weight & by volume). Able to follow process instructions, read Technical data sheets and apply coating to de
Career Center | BANGALORE, India | Engineering,Management,Production,Purchasing,Quality Control,Sales/Marketing,Technical Support
With an experience of 5 years well verse in technical skills of electronic component procurement, knowledge in both hardware and SMT production with process, quality approval, IPC Standards, data sheet reading,analyzing ability,process and people man
Career Center | costa mesa, California USA | Engineering
� Support all training in Engineering Lab, Maintained Engineering Services Lab in Irvine, Ca, Support soldering training and Fast Track Assy. Line for Rockwell International, El Paso TX. � Assemble / re-work/modify electronic breadboards and printed
SMTnet Express, February 15, 2024, Subscribers: 25,341, Companies: 12,015, Users: 28,702 █ Electronics Manufacturing Technical Articles Everything You Ever Wanted to Know About Laminates... but Were Afraid to Ask It has been over 25
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ko-KR/divisions/efd/contact-us/request-a-solder-safety-data-sheet
Safety Data Sheet 요청 | Nordson EFD Nordson EFD 노드슨 사 | 전세계 거점 검색 (영어) 사업부에만 해당 Nordson 전체 제품 부속품, 키트 & 보조 장비 동물 보건 투약 시린지 자동화 디스펜싱 시스템 구성 품 컨트롤러 & 제어 시스템 디스펜스 팁 충진 시스템 정밀 액체 디스펜서 제트 디스펜싱 시스템 윤활 시스템 믹서 해충 방제 시스템 액체 공급장치 및 펌프 솔더 페이스트 시린지 배럴 & 카트리지 열
ORION Industries | http://orionindustries.com/pdfs/formex.pdf
FORMEX GK/FORMEX FLAME RETARDANT POLYPROPYLENE DATA SHEET TEST METHOD FORMEX-10 FORMEX GK-10 FORMEX GK-17 FORMEX GK-30 FORMEX GK-40 COLOR NATURAL NATURAL/BLACK NATURAL/BLACK NATURAL/BLACK NATURAL/BLACK THICKNESS-INCH .010 + .003/ –.0015 .010 + .003/ –.0015 .017 + .003/ –.001 .030 ± .002 .040
