Industry Directory | Manufacturer's Representative
WE ARE SUPPLIER OF CHEMICALS AND EQUIPMENT FOR ELECTROPLATING IN PCB.
EIMC (Electronics Industry Manufacturing Consultants) was founded focusing on electroplating technology improvement and process development. EIMC works with a broad spectrum of industry EMS providers, manufacturers and supppliers.
New Equipment | Soldering - Other
HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce production cost, create a greener environment and assist the quality process. Use special stirring system to melt
New Equipment | Assembly Services
ETA LED Laser Marking Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. LED Laser Marking Machine,Led Bulb Laser Machine,LED Bulb Fi
Electronics Forum | Wed May 04 06:06:34 EDT 2011 | clampron
Good Morning, I have been working with a company that has a selective electroplate touch up system from Rapid Electroplate. They have used this for repairing gold electroplate. Scratches and in some cases, replating pads that had been contaminated w
Electronics Forum | Mon May 11 11:05:08 EDT 2009 | milas
Hi 1. Does anyone know what the pros and cons are of ENIG vs Electroplating ? 2. Is there a likelyhood that in either of these processes the gold can flake off after a period of time ? Thanks in advance Milas
Used SMT Equipment | Semiconductor & Solar
LPKF Multipress II 2005 220VAC Single phase Appears to be in like new condition. Powers up and cycles. FOB: Origin Also available: LPKF Bench top printer and LPKF Zelflow bench top reflow oven. Contact: AssuredTechnicalServiceLLC@Gmail.com
Used SMT Equipment | Assembly Accessories
LPKF Multipress II 2005 220VAC Single phase Appears to be in like new condition. Powers up and cycles. FOB: Origin Also available: LPKF Bench top printer and LPKF Zelflow bench top reflow oven OEM Description: Footprint: approx. 0.25 m²
Industry News | 2012-06-13 08:49:05.0
On Tuesday, June 5, 2012, leaders of IPC’s Environment, Health and Safety (EHS) Committee met with senior U.S. Environmental Protection Agency (EPA) staff to discuss regulatory relief for printed board manufacturing.
Industry News | 2011-10-03 15:37:21.0
The SMTA announced a session on Challenges and Solutions for PCB Technology which will take place on Tuesday, October 18 during their annual conference, SMTA International
Technical Library | 2021-11-03 17:05:39.0
Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.
Technical Library | 2021-05-26 00:53:26.0
This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, reduced line widths, smaller through-holes and microvias are all attributes of these High Density Interconnect (HDI) packages. Filling the microvias with conductive material allows the use of stacked vias and via in pad designs thereby facilitating additional packaging density. Other potential design attributes include thermal management enhancement and benefits for high frequency circuitry. Electrodeposited copper can be utilized for filling microvias and provides potential advantages over alternative via plugging techniques. The features, development, scale up and results of direct current (DC) and periodic pulse reverse (PPR) acid copper via filling processes, including chemistry and equipment, are described.
HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce production cost, create a greener environment and assist the quality process. Use special stirring system to melt
ETA LED Laser Marking Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. LED Laser Marking Machine,Led Bulb Laser Machine,LED Bulb Fi
Events Calendar | Fri Apr 16 00:00:00 EDT 2021 - Fri Apr 16 00:00:00 EDT 2021 | ,
Auburn University Student Chapter Event: Get Hired in Electronics Industry
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
SMTnet Express, November 1, 2018, Subscribers: 31,427, Companies: 25,347, Users: 25,347 High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Processes Saminda Dharmarathna, PhD, Ivan Li, PhD, Maddux Sy, Eileen Zeng, Bob Wei
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20060405647
*Mark McMeen, Magnalytix, LLC Milo Fabriciton of High Strength Nico Alloy and Rh Coating Using Electroplating Method Jae-Ho Lee, Hongik University 2:45PM - 3:00PM Courtyard 3:00PM - 3:30PM Lehua/Hau 3:30PM - 4:00PM Lehua/Hau 4:00PM - 4:30PM Lehua/Hau 4:30PM - 5
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
. Once removed, a thin coating of copper is deposited on all exposed parts of a panel, creating a metallic base for the electroplating process
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