The OmniES™ is proven to exceed lead-free profile requirements and delivers efficient high performance thermal processing. IsoThermal™ Chamber Technology The OmniES offers a combination of innovation and industry-proven technologies in
The OmniMax reflow soldering system is designed to deliver maximum thermal performance combined with process capability and control. IsoThermal™ Chamber Technology The OmniMax reflow soldering system is designed to deliver maximum thermal per
Electronics Forum | Wed Jan 24 22:38:45 EST 2007 | electrovert
Hello, My first time post up here. I have a problem with thermo runaway on upper zone #5 on the Omni 10 Electrovert. We changed the thermocouple #5 but the problem came back up. We swapped Sensoray board 8 and 9, swapped board #3 (T/C interface boar
Electronics Forum | Sat Jul 01 00:20:08 EDT 2017 | aemery
Kelly, it's been a long while since I repaired a BRAVO. The machine was a little unique as far as Electrovert ovens go. I am pretty sure that it is the only Speedline model that integrated a PLC. Loved the OMNI's, not so much with the Bravos. I a
Industry News | 2016-02-24 15:04:42.0
Coming off a highly successful global launch at Productronica in November, the MPM Edison printing system makes its North American debut at this year's Apex show. As the next generation in printing technology, with patented features throughout its design, the Edison operates at twice the speed and with 25% more accuracy than other printers. With an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, the Edison is capable of reducing your total cycle time by as much as 15 seconds as compared to competitive printers (includes stencil wipe and printing).
SMTnet Express, May 17, 2018, Subscribers: 31,044, Companies: 10,939, Users: 24,723 Statistical Aspect on the Measuring of Intermetallic Compound Thickness of Lead Free Solders Azman Jalar, Maria Abu Bakar, Roslina Ismail, Abdul Razak Daud
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
