Industry Directory | Manufacturer
Tough devices for tough environments. Rugged Science offers multiple solutions for any industry with our embedded devices.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Innov-X Systems specializes in portable and on-site elemental analysis using X-ray Fluorescence (XRF) spectroscopy. A simple solution for RoHS Compliance Screening - simultaneously screen for all five restricted RoHS elements in a
Weighing just 3.3 lbs., the Innov-X Handheld instruments are truly portable XRF. They are ideal for instant elemental analysis of any element from Phosphorus to Uranium.
Innov-X Systems continues to pioneer the XRF industry with innovative and revolutionary products. Always striving to provide the best in XRF elemental analysis, detection limits and applications support to our customers, Innov-X delivers superior pro
Electronics Forum | Fri Aug 29 10:18:31 EDT 2008 | rrpowers
We saw this one time when we were trying to develop some lead-free product. It ended up being copper migration. Some of the pads had a brown discoloration and those that did would not wet very well. Your elemental analysis would have shown if ther
Electronics Forum | Wed Sep 02 11:54:34 EDT 2009 | davef
You can determine empirically what will work. * Use ion chromatography [IPC-TM-650 2.3.28] to evaluate the residues and determine if the residues must be removed. * Use energy dispersive spectroscopy for the elemental analysis or chemical characteriz
Used SMT Equipment | In-Circuit Testers
JDSU FireBerd 8000-CFB8000-02-C2000-V6 Communications Analyzer JDSU FB8000 The FIREBERD 8000 combines the success of two highly successful test platforms - the FIREBERD 6000A and the TestPad. As a datacom analysis module for the TestPad, the por
Used SMT Equipment | In-Circuit Testers
JDSU FireBerd 8000-CFB8000-02-C2000-V6 Communications Analyzer JDSU FB8000 The FIREBERD 8000 combines the success of two highly successful test platforms - the FIREBERD 6000A and the TestPad. As a datacom analysis module for the TestPad, the por
Industry News | 2003-02-13 08:11:45.0
eSight Can Reduce Time-to-manufacture and Time-to-market by as Much as 80%
Industry News | 2003-07-03 08:45:09.0
Leading Electronic Manufacturing Service Provider Leverages Tradec Solution to Manage Commodity Cost and Accelerate the Quotation Process
Technical Library | 2021-08-11 00:57:57.0
This paper shows the Design and Finite Element analysis of vacuum chamber of potting machine designed for electronic ignition coil applications. There are two types of potting methods 1) With Vacuum 2) Without Vacuum.
Technical Library | 2015-02-19 16:54:34.0
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
Career Center | San Diego, California USA | Engineering
Kodak - A Design & Product Testing Engineer is responsible for oversight of ink jet printer projects being conducted by the Testing and Customer Assurance area. Oversight includes assurance of the data integrity as well as effective collection, redu
Career Center | South Plainfield, New Jersey USA | Sales/Marketing
MacDermid Alpha Electronics Solutions, an Element Solutions, Inc. business and world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | vestal, New York USA | Quality Control
Over 7 years of experience as lead quality engineer in the filed of SMT. Extensive knowledge on Universal GSM,GC60 and GC120 Machines. worked on IBM Rational and Mercury Winruner testing tools.
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
. This is usually done through finite element analysis. Solder joint modeling must be performed at different levels to take into consideration all aspects of solder joint reliability
| https://www.eptac.com/faqs/ask-helena-leo/ask/multiple-wash-steps-affecting-resistance-characteristics
. Many reasons could cause this issue, so my suggestion would be to have the component sent to a lab for surface analysis to determine whether or not the problem is contamination or deterioration of the resistive element