JUKI Nozzle for 700&2000 series KD775&780E3401-802-000JUKIKD775 DISP NZ S2D/1S 0.6/0.3P=0.7E3406-802-00JUKI KD775 DISP NZ M1D/2S 0.7/0.4P=1.0E3411-802-000JUKI KD775 DISP NZ L1D/1S 0.9/0.6P=1.5E3416-802-000JUKI KD775 DISP NZ LL 2D/2S 0.9/0.6P=1.5E342
ASCEN technology specializing the PCB assembly equipment and the SMT solution. Please check the more detail link : www.pcb-separator.com Any inquiry please sent the email to : info@pcbasc.com , and add the Skype NO.: supplier889 This is our mult
Electronics Forum | Mon Feb 04 16:45:40 EST 2002 | bdoyle
Saying "yes" to that dialog box shouldn't have any adverse effects. Its just the flash player (I thought 5 was the latest version) .It is for some of the newer ads that are appearing. By switching to flash for many of these banners we are able to l
Electronics Forum | Tue May 05 15:45:37 EDT 1998 | Dave F
| Looking to buy used or new tubes, that will fit an SOIC-16 | Need these tubes ASAP. We need to bake these parts and drypack. | Please email or call if you can help. | Eric Jenkins | 801 956-0897 Eric I'm not sure of the manufacturer of the parts th
Used SMT Equipment | Flexible Mounters
Product Name: Samsung high speed SM411 chip mounter Product number: SM411 Detailed product introduction Samsung high speed SM411 chip mounter parameters type: SM411 On the way: In - flight vision Number: 6 - axis *2 axis platform mount speed:
Used SMT Equipment | SMT Equipment
Product Name: Samsung high speed SM411 chip mounter Product number: SM411 Detailed product introduction Samsung high speed SM411 chip mounter parameters type: SM411 On the way: In - flight vision Number: 6 - axis *2 axis platform mount speed:
Industry News | 2016-05-16 20:59:04.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-07-02 06:40:16.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Parts & Supplies | Pick and Place/Feeders
FUJI NXT H04 5.0 Nozzle Model :FUJI NXT H04 5.0 Nozzle FUJI Nozzle List Brand Machine Model Specification Material of nozzle tip FUJI CP3 / CP4 Bore diameter 0.7 / 1.0 / 1.3 Tungsten steel FUJI CP6 / CP7 Bore diameter 0.7 / 1.0 / 1.3 / 1.8 T
Parts & Supplies | Pick and Place/Feeders
FUJI NXT H04 5.0G Nozzle Model: FUJI NXT H04 5.0G Nozzle FUJI Nozzle List Brand Machine Model Specification Material of nozzle tip FUJI CP3 / CP4 Bore diameter 0.7 / 1.0 / 1.3 Tungsten steel FUJI CP6 / CP7 Bore diameter 0.7 / 1.0 / 1.3 / 1.8 Tu
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