New SMT Equipment: embedded capacitance (5)

FaradFlex�  - Materials for Embedded Capacitance

FaradFlex� - Materials for Embedded Capacitance

New Equipment |  

Oak-Mitsui has developed a novel thin substrate, FaradFlex�, which is the next generation of Buried Capacitance material. Buried Capacitance utilizes the technology of putting a capacitor plane inside the PCB to reduce the overall impedance of the po

Oak Mitsui Inc.

Printed Circuit Boards Fabrication.

Printed Circuit Boards Fabrication.

New Equipment | Fabrication Services

High Layer Count, High Complexity, High Reliability. At i3 Electronics, we offer the total package for your printed circuit board fabrication. We can design, manufacture, assemble, and test your PCB. Our specialty is high layer count, high complexi

i3 Electronics

Electronics Forum: embedded capacitance (6)

Embedded Capacitance

Electronics Forum | Fri Apr 03 02:10:30 EDT 2009 | Adam

Thanks Dave Adam

Embedded Capacitance

Electronics Forum | Fri Mar 20 04:28:08 EDT 2009 | milas

Hi Does anyone have any experience with assembling pcbs that have embedded capacitance ? are there any do's and dont's over and above manufacturing a standard mulit-layer pcb ? Tahks inadvance Milas

Industry News: embedded capacitance (65)

EVOLVING TECHNOLOGIES SUMMIT ANNOUNCED

Industry News | 2008-04-21 14:58:41.0

Minneapolis**, MN�* An Evolving Technologies Summit is scheduled during the SMTA�s annual conference, SMTA International, at the Disney's Coronado Springs Resort and Convention Center, Orlando, FL, from August 17-21, 2008.

Surface Mount Technology Association (SMTA)

Technical Library: embedded capacitance (2)

Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors

Technical Library | 2007-11-21 11:39:13.0

This paper discusses laser micromachining of barium titanate (BaTiO3)-polymer nanocomposites and sol-gel thin films. In particular, recent developments on high capacitance, large area, and thin flexible embedded capacitors are highlighted.

i3 Electronics

Reliability of Embedded Planar Capacitors under Temperature and Voltage Stress

Technical Library | 2015-05-21 18:46:31.0

In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125oC and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers.

CALCE Center for Advanced Life Cycle Engineering

Videos: embedded capacitance (1)

Introduction of new model ST-5 of Smart Tweezers LCR-meter.

Introduction of new model ST-5 of Smart Tweezers LCR-meter.

Videos

Introduction of new model ST-5 of Smart Tweezers LCR-meter from Siborg Systems Inc, Waterloo, Ontario, Canada, http:\\www.smarttweezers.ca

Siborg Systems Inc

Training Courses: embedded capacitance (1)

Career Center - Resumes: embedded capacitance (1)

Electronics technician

Career Center | NEW DELHI, India | Technical Support

I am having almost 20 years of experience in the field of electronics repairs domestic & industrial, able to work on any circuit and PCB without any schematic or diagram. I have all the records and certifications with me and fully c

Express Newsletter: embedded capacitance (82)

SMTnet Express - May 21, 2015

SMTnet Express, May 21, 2015, Subscribers: 22,770, Members: Companies: 14,358, Users: 38,224 Reliability of Embedded Planar Capacitors under Temperature and Voltage Stress Mohammed A. Alam, Michael H. Azarian, Michael Osterman and Michael Pecht

Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure

Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure Embedded passives


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