STOCKING DISTRIBUTOR OF I.C.'S,PRIMARILY SEMICONDUCTORS,OBSOLETE, HARD TO FIND, OR LONG LEAD-TIME PRODUCT.
ORION has emerged as a leader in the fabrication of heavy gauge electrical insulation products. We route many materials such as TW Formex®, Statex®, GE's Lexan®, and acrylics. Their typical thicknesses is between 0.060" and 0.25".
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
Electronics Forum | Fri Sep 04 11:36:42 EDT 2020 | inspiredmorris20
!!UPDATE!! We have found the issue, power supply #3 was bad. The PSU was not sending 24v to the emergency system which is normally a closed circuit. Being that the emergency system was not getting the 24v it assumed the e-stop had been depressed. T
Electronics Forum | Thu Jun 14 08:49:36 EDT 2001 | adam
I'd like to know what advantages are there to use silver emerge PCB's. Currently we are using HASL boards, and we are having problems especially using BGA connectors. Any help will be appreciated. Adam.
Used SMT Equipment | Conveyors
Details: • FIFO/LIFO • 30 slots • Input and Output conveyors • Motorized width adjustment • Programmable digital interface • SMEMA compliant • EPO Emergency stop button Condition: Complete & Operat
Used SMT Equipment | X-Ray Inspection
Make: Creative Electron Model: TruView Cube Mini X-Ray System Vintage: 2015 Details: • 80Kv • Spot Size: 33 um (Minifocus) • X-Ray Camera: 1’ x 1.5”, 1FPS, 14-bit flat panel • Sample Manipulation: Motorized XY t
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2003-02-07 09:13:12.0
The Sessions Covered Current and Emerging Technologies
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Parts & Supplies | Screen Printers
Product Name: P7061 emergency switch button Part Number: P7061 Description: P7061 ACTUATOR, EMERGENCY PUSHBUTTON emergency switch button Applicable models: UP; AP Printing Presses P7061 ACTUATOR, EMERGENCY PUSHBUTTON emergency switch button
Parts & Supplies | SMT Equipment
Emergency switch button(P7061) Product Name: P7061 emergency switch button Part Number: P7061 Description: P7061 ACTUATOR, EMERGENCY PUSHBUTTON emergency switch button Applicable models: UP; AP Printing Presses P7061 ACTUATOR, EMER
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
00354974-01 ACTIVATOR LED 00354976-01 Power Supply 24V DC 00354977-01 Emergency Stop Button 00354978-01 Emergency Stop Switchgear 00354979S01 Simovert Masterdrive Lifting Axis 00354980S01 Simovert Masterdrive Feed Axis 00354981-01 Optocoupler
00372624-01 Micro Switch Tower1, configured 00372625-01 Min. Position Limit Switch, configured 00372627-01 Toothed Belt AC Motor 00372628-01 Micro Switch Tower2, configured 00372629-01 Cable: Disengaging Driver Tower1 00372632-01 Cable: Feed Axi
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
Events Calendar | Tue Jun 27 00:00:00 EDT 2017 - Wed Jun 28 00:00:00 EDT 2017 | Dusseldorf, Germany
IPC Reliability Forum: Emerging Technologies
Events Calendar | Fri Jun 07 00:00:00 EDT 2019 - Fri Jun 07 00:00:00 EDT 2019 | San Jose, California USA
ITI and IPC Conference on Emerging & Critical Environmental Product Requirements
Career Center | , California USA | Management,Sales/Marketing
Sales Directors, BDM's over Start-ups, Global Program Managers URGENTLY NEEDED! Please visit www.dcsiconsultants.com to learn about all of the positions we're actively searching on. They range from Sales Directors, Emerging Accounts/Technology Sta
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | Chennai, Tamilnadu India | Engineering,Maintenance,Purchasing,Quality Control,Sales/Marketing,Technical Support
I have two year experience in debugging and SMT,THT, and BGA reworking at Avalon technology..
Career Center | chennai, India | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
Two years working in EMS(process and Equipment Engineer)
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/solutions/medical
. Precision, accuracy, and reliability are mandatory in the manufacture of medical device components. In recent years, yield improvement and rework systems have emerged as areas of significant interest to manufacturers of PCBs used in medical device assembly
| https://productronica.com/en/trade-fair/press/press-releases/detail/messe-muenchen-and-semi-expand-cooperation-in-india.html
. India has emerged as an attractive destination for semiconductor manufacturing and sourcing due to its growing domestic market and demand for electronics
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