Lighthouse specializes in Low Pressure Injection Molding for encapsulation / protection of electronics.
Industry Directory | Manufacturer
Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Used SMT Equipment | Coating and Encapsulation
vintage:2015 1 unit in stock
Used SMT Equipment | Coating and Encapsulation
O/S: Windows XP Details: • SC200 HS head • 100-120v, 208-240V • Single Phase • 50 / 60 HZ Location & Shipping: LCI FL / FOB origin
Industry News | 2012-02-15 19:18:44.0
GPD Global announces that its PCD4H Dispense Pump yields excellent results with phosphor and non-phosphor-filled LED encapsulation as viewed on the color chart by tightly grouped results.
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Technical Library | 2023-08-16 18:13:53.0
In one of our Consumer Electronics projects, a smart lighting company wished to dispense silicone-based LED encapsulation material for two different product sizes. The larger product had a 9mm circular dam which required silicone dispensing flush with the top of the dam. The smaller product had a 1mm LED die that required only the top to be encapsulated. The material consisted of two parts which were mixed by weight in a 1:1 ratio. A phosphor powder was added totaling 10% of the overall weight. The phosphor required agitation to remain suspended.
Technical Library | 2023-08-16 18:20:44.0
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Events Calendar | Mon Apr 12 18:30:00 UTC 2021 - Mon Apr 12 18:30:00 UTC 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Mon Apr 12 18:30:00 UTC 2021 - Mon Apr 12 18:30:00 UTC 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | San Jose, California USA | Engineering,Technical Support
1.PC Board Design Engineer DRAM Memory Module, Flash product(Card, SSD, USB) design/Layout. Motherboard and flash controller experience is a plus. BSEE degree. 2.Mechanical Design Engineer Mechanical design, modeling for high volume plastic pa
Career Center | , | Engineering,Research and Development,Technical Support
For over 50 years, Emerson & Cuming has been designing and manufacturing high performance encapsulants, adhesives, and coatings for the automotive, telecommunications and electronic industries. Our expansive breadth of technologies combined with our
Career Center | Temecula, California USA | Engineering
Over five years of experence developing semi-conductor, industrial, and electronic packaging applications (i.e., Underfill, SMA, Encapsulation, Dam and Fill, Gasket, Flux, Conformal Coating). Provided technical and process support for automated fluid
Career Center | Flower Mound, Texas USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
SMT and THT Soldering Process Optimization Working knowledge of MPM Screen Printers, Fuji and Siemens Placement Equipment, BTU, ERSA and Vitronics Reflow Ovens, Camalot 3500 Underfill Dispense Machine, SEHO and Electrovert Wave Soldering Systems
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page Book Review by Brian Ellis Title: An Engineer's Handbook of Encapsulation and Underfill Technology Author
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/encapsulant?page=2
ASYMTEK's DV-01 is a basic time pressure valve compatible with adhesives, solder masks, solder pastes, epoxies, and encapsulants Valve - DV-8000C Heli-Flow Pump Nordson ASYMTEK's DV-8000C Heli-Flow®
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_asymtek_1010_dispenser.html
Jets a wide range of fluids including underfill, SMA, encapsulants, conformal coating, UV adhesives and silver epoxy Fast - jetting eliminates z-axis motion Accurate - jetting is highly repeatable
