Industry Directory: endicott (1)

i3 Electronics

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A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Electronics Forum: endicott (10)

Re: Cigerette Smoke Contamination of PCA's

Electronics Forum | Mon Feb 14 21:01:15 EST 2000 | Thomas Ravener

IBM, Endicott, New York did extensive research on that. There was also some information I think that was published. You may want to contact Howard Manko of Manko & Associates. He's the soldering guru and has written many books on soldering & solderab

Re: 1 mil or 25 um trace width

Electronics Forum | Thu Apr 29 09:02:02 EDT 1999 | Frank Boyko

| Can anyone in this world produce such small PCB/PWB trace widths? Lots of theory so far, but have not found anyone yet who can do it in practice. If anyone can it will be IBM. Call Voya Markovitch at 607-757-1335 (Endicott, NY). He is a technical

Industry News: endicott (63)

Endicott Interconnect Goes to 4-Day Work Week

Industry News | 2003-01-31 08:23:54.0

To Compensate for Softer PCB Demand

SMTnet

Frigid Climate, Industry Can't Stop Some from UIC Seminar

Industry News | 2003-02-07 09:13:12.0

The Sessions Covered Current and Emerging Technologies

SMTnet

Technical Library: endicott (4)

Organic Flip Chip Packages for Use in Military and Aerospace Applications

Technical Library | 2006-11-14 12:48:31.0

Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package

i3 Electronics

Printable Nanocomposites for Electronic Packaging

Technical Library | 2008-06-25 16:11:51.0

Printing technologies provide a simple solution to build electronic circuits on o low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technology. Advanced printing is relatively new technology and need more characterization and optimization for practical applications. In the present paper, we examine the use of nanocomposites or materials in the area of printing technology.

i3 Electronics

Career Center - Resumes: endicott (1)

Sr. Systems Analyst, Sr. Software Engineer

Career Center | Vestal, New York USA | Engineering,Research and Development

Experienced Sr./Principal Software Engineer and Systems Analyst in various applications, especially embedded real time systems and device drivers and board support including 80x86, Power PC, Motorola 68K, TI DSPs and a number of other platforms using

Express Newsletter: endicott (63)

Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate

Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Endicott Interconnect Technologies Credit/Source: Michael J. Rowlands, Rabindra Das More and more

Partner Websites: endicott (77)

Membership Directory Results

Surface Mount Technology Association (SMTA) | https://www.smta.org/directory/suppliers.html

     CyberOptics Corporation   Minneapolis, MN      Datum Alloys   Endicott      DEKRA iST Reliability Services Inc.   Hsinchu City, Taiwan      DG Marketing Corporation   Austin, TX      Digitaltest, Inc.   Concord, CA      E.T.S. Group, Inc

Surface Mount Technology Association (SMTA)


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