Industry Directory | Manufacturer
a company set up more than 10 years, have UL certification: PCB products widely used in Hi-Tech industries,Power supply, Telecommunication, Industrial control,Digital products,lED lighitng,etc.
Industry Directory | Manufacturer
The company was founded in 2000. UL certification, prototype & mass production, urgent express delivery, excellent quality, competitive price, most of products exported to all over the world, and get highly appreciated.
New Equipment | Surface Finish
Technic supplies precious metal and tin and tin alloyed products that are used to preserve as well as enhance soldering and bonding through all levels of interconnection. Technic is well established as a leader in Final Finish Solutions for printed
Technic Releases TechniCatalyst AT4608 A New High Performance Palladium Activator for TechniPad ENIG, ENIPIG and ENEPIG Plating ProcessesCranston RI, USA – Technic has announced the release of TechniCatalyst AT4608, a high performance palladium acti
Electronics Forum | Wed Feb 10 16:51:01 EST 2010 | flipit
Anyone using ENEPIG electroless nickel electroless palladium immersion gold? Am currently using selectively plated gold 25 micro inches in combo SMT/COB gold ball bonded product. Gold cost has increased over the years. Palladium cost is much lower
Electronics Forum | Tue Sep 10 10:42:36 EDT 2013 | capse
Plasma cleaning is used extensively to clean surfaces prior to wire bonding.
Industry News | 2011-12-21 22:41:39.0
Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Technical Library | 2023-01-10 20:08:36.0
Nickel corrosion in ENIG and ENEPIG is occasionally reported; when encountered at assembly it manifests as soldering failures in ENIG and wire bond lifts in ENEPIG. Although not common, it can be highly disruptive, resulting in missed deliver schedules, supply chain disruption, failure analysis investigations, and liability - all very costly.
Technical Library | 2023-01-06 16:18:23.0
PCB/Substrate Finishing Overview - iNEMI - PCB Surface Finish Overview. Surface Finish deployment ranked by surface area. OSP greatest. Imm Tin. ENIG. Silver. ENEPIG.
Events Calendar | Tue Sep 22 00:00:00 EDT 2020 - Tue Sep 22 00:00:00 EDT 2020 | Eden Prairie, Minnesota USA
Risk Analysis in Electronic Assemblies
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers SMTnet Express October 11, 2012, Subscribers: 25550, Members: Companies: 9005, Users: 33789 Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5495
: The influence of the electroless deposition of Pd in electroless Ni-P/electroless Pd/immersion Au (ENEPIG) plating was investigated on the reliability of Au and Cu wire-bonding
