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Electronics Forum | Mon Sep 09 15:38:02 EDT 2013 | arendonk
Hi, We are having issues aluminum wirebonding on ENEPIG plated PCB by a too low pull force and or having lifts (1% range). Could any body advice how to solve this problem? Is there a special wire bond grade required? How to best clean contaminant
Electronics Forum | Tue Sep 10 10:42:36 EDT 2013 | capse
Plasma cleaning is used extensively to clean surfaces prior to wire bonding.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers SMTnet Express October 11, 2012, Subscribers: 25550, Members: Companies: 9005, Users: 33789 Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
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