Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
New Equipment | Cleaning Equipment
Supply suction nozzle cleaning machine, automatic / SMT suction nozzle cleaning machine / Shenzhen manufacturer details Product Name: suction nozzle cleaning machine Product model: hn-nc207 Application: use pulse pressure cleaning method to remove
New Equipment | Cleaning Equipment
PCBA Cleaning Machine for Electronics Assembly Line Elevate your PCBA production with our advanced PCBA Cleaning Machine. Effortlessly remove flux residues and contaminants, ensuring pristine PCB assemblies for top-notch performance. ❙ Introduc
Electronics Forum | Thu Nov 30 21:23:44 EST 2000 | Dave F
Design more products and get wealthy. Don't waste your time and energy in areas that others are accomplished. A friend designs boards, sells $10M [what that is in euro, funny money, I don't know or care] of them a year, with a company of five [in
Electronics Forum | Sat Feb 02 12:50:11 EST 2008 | fastek
All this dicussion of salaries and job losses came to mind when I saw this article. Maybe a competent technical guy disillusioned by the state of the current electronics manufacturing landscape in this country has something to fall back on..........
Used SMT Equipment | Soldering - Reflow
Energy Tech Systems Curing/Reflow Oven. Model 4814. Very Good Condition. 208V, 3 Phase, 60 Amps. IR, Edge chain rail. 4 heating zones one cooling zone. 2 inch clearance for curing assemblies with tall components. PCB width adjustment and speed adju
Used SMT Equipment | Soldering - Reflow
TrioTek: Ultraviolet UV Curing, IR Thermal Curing, Moisture Curing for encapsulants, adhesives, conformal coatings and potting compounds TrioTek™ inline curing ovens from ETS are ideal for medium to high-volume curing or drying of encapsulants, con
Industry News | 2020-07-07 13:55:37.0
MIRTEC is pleased to announce that Gentec, a Québec-based design and manufacturing company specializing in rugged and reliable custom-made products and solutions in the fields of high-tech, power and power management electronics, has selected MIRTEC's award-winning MV-3 OMNI Desktop 3D AOI system. The MV-3 OMNI is the perfect 3D Inspection Solution to strengthen Gentec's commitment to uncompromised production quality.
Industry News | 2003-03-31 09:31:11.0
Electronic contract manufacturers face tough realities
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Parts & Supplies | Pick and Place/Feeders
ZK Electronic Technology Co.,Limited supply JUKI placement machine original parts, JUKI placement machine repair, JUKI Mounter feeder JUKI Mounter nozzles, JUKI Mounter Board Repair, JUKI Mounter Motor Repair, JUKI SMD Laser repair, JUKI placement m
Parts & Supplies | Screen Printers
DEK Energy Board 128908 FOB: MN Contact: AssuredTech@yahoo.com
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
Technical Library | 2019-05-29 10:38:59.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
General of machine: 1.The in line curing machine (ICM Series) is idea for high volume curing production.They are easy to integate with different Conformal Coating machines. 2.Available in different lengths,they provide the flexibility to match your
High quality PCB Fully Automatic IR curing Oven Coatflow ICM-3300 General of machine: 1.The in line curing machine (ICM Series) is idea for high volume curing production.They are easy to integate with different Conformal Coating machines. 2.Availa
Career Center | FREMONT, California USA | Sales/Marketing
Excellent opportunity for a highly motivated individual interested in a long term sales career in the Tech industry. Macrotron is seeking an Sales Associate to handle accounts for electronic manufacturing services. EMS services include assembly, SMT,
Career Center | Manhattan Beach, California USA | Sales/Marketing
Attention Sales people! Electronic Conventions Inc., ECI, a leader in the tradeshow industry for over 50 years and producer of North America's largest trade show for EOEM solutions in the world, is hiring for an inside exhibit-space Sales Representa
Career Center | , | 2013-01-24 13:12:30.0
Write now I am working as a Production Engineer of Mobile Charger and CFL.Assembling of componenens over PCB,Soldreing has to be done under my supervision.
Career Center | Palm Bay, Florida USA | Engineering,Production
1 year of SMT production experience in a low/med volume, high mix environment. IPC-A-610 Certified Specialist. Reflow profiling experience Heavy CAM programming experience with prototypes and new products
Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives Thermal Spot Curing of Adhesives with Photonic Energy; A novel fiber delivery
The Environmental Impact of Pick-and-place Machines News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! The Environmental Impact of Pick-and-place Machines Energy labels are a
| https://www.eptac.com/news/eptac-corporation-conducts-j-std-001-compliance-audit-of-columbia-tech/
: semiconductor, medical device, food service, storage, networking, alternative energy, security and military. Columbia Tech is ISO 9001:2000 and ISO 13485:2003 Registered. EPTAC Corporation has been providing training, certification and consulting in the electronics assembly industry for more than 20 years
| https://www.smtfactory.com/I-C-T-Fast-Flexible-Semi-auto-SMD-PCBA-Production-Line-pd44688464.html
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A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
98 Elm St.
Portland, ME USA
Phone: 1-207-775-6139
