1076 enig pcb with high pt content vs reflow soldering results

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SMTnet Express - April 15, 2021

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Journal of SMT Articles

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, Jörg Trodler, Adam Murling Abstract 2018 31-2 Fill The Void III Tony Lentz Abstract 31-2 Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate - Influence of Eigenmodes

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