Industry Directory | Manufacturer
Langke Automation Equipment Co.,Ltd(smdmachine.com) is a nation high-tech enterprise which specialized in integrating R&D, production, sales and service for the led high speed mounting machine, reflow oven, solder paste printer...
Industry Directory | Manufacturer
We offer new and quality second user equipment, Service mount pick and place, Universal through hole insertion, Wave solder, Reflow, Screen Print,Inspection
New Equipment | Assembly Services
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
explorFlow - SMT reflow system,Made by Vanstron Automation A high-quality reflow oven for medium/large production in the SMT industry. Fully prepared for the lead-free soldering process, this oven attains excellent thermal uniformity. Main Featu
Electronics Forum | Tue Feb 11 07:35:03 EST 2020 | dontfeedphils
If all else fails, you can always chipbond the part. Would it be possible to run this side as the second reflow?
Electronics Forum | Wed Feb 12 07:25:47 EST 2020 | dontfeedphils
If you have control of the solder alloy you're able to use on the product, you could run a lower temp solder on the second side and try to avoid the first side entering reflow.
Used SMT Equipment | Chipshooters / Chip Mounters
KE3010 High-speed Placement Machine JUKI KE3010 High-speed Placement Machine Our main products are [second-hand high-speed placement machine, smt second-hand placement machine, second-hand automatic placement machine, reflow, JUKI placement machin
Used SMT Equipment | Soldering - Reflow
Heller REFLOW OVEN MK3 2013 Condition: 2013 USED Standard type Feel free to contact me if interested!! Availability: Available on backorder The 1800 models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per min
Industry News | 2019-09-12 22:51:52.0
Learn first-hand the experiences, challenges and solutions our leaders are taking to achieve truly smart manufacturing.
Industry News | 2020-10-19 14:25:19.0
MIRTEC is pleased to announce that Niche Electronics & QCMS have selected MIRTEC's MV-6 OMNI 3D AOI machine to meet their ongoing commitment to flawless manufacturing quality. The Award-Winning MV-6 OMNI is the perfect 3D Inspection Solution to enable both facilities to achieve 100% customer satisfaction.
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Parts & Supplies | Pick and Place/Feeders
AF8X4 Mechanical Feeder Our main products are [second-hand high-speed placement machine, smt second-hand placement machine, second-hand automatic placement machine, reflow, JUKI placement machine] and so on. Our company I is one of the largest supp
Parts & Supplies | Pick and Place/Feeders
Electric Feeder 8MM Original new Our main products are [second-hand high-speed placement machine, smt second-hand placement machine, second-hand automatic placement machine, reflow, JUKI placement machine] and so on. Our company I is one of the lar
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
BESTEMP reflow checker 6 channel temperature profiler Reflow soldering temperature tester Characteristic: 1..High efficiency, data can be stored up to 16 times continuously, and can be downloard to computer for group data viewing. 2. Modular analys
Career Center | Tampa, Florida USA | Production
Help Reptron Electronics be a leader in the Electronics industry by acting as the Process Engineering Technician on 2nd Shift for our Printed Circuit Board Manufacturing Division in Tampa, Florida. Reptron is a large contract manufacturer providing s
Career Center | Tampa, Florida USA | Engineering,Maintenance,Production,Technical Support
Help Reptron Electronics be a leader in the Electronics industry by acting as the Process Engineering Technician on 2nd Shift for our Printed Circuit Board Manufacturing Division in Tampa, Florida. Reptron is a large contract manufacturer providing s
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | Wroclaw, Poland | Engineering
Certified IPC Specialist (CIS) IPC-A-610D Honeywell SPOC online training Six Sigma Lean Manufacturing Training Certificate FUJI CP-6 and NXT training: Operating, Maintenance, Programming I can program SMT Fuji machines using Flexa software, maintain
| http://etasmt.com/cc?ID=te_news_bulletin,14961&url=_print
. The bottom component of the large board is easily dropped during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems
Heller Industries Inc. | https://hellerindustries.com/1913-mark-5-series-smt-reflow-oven/
SMT Reflow Oven -MK5 SMT Reflow Oven Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
