Electronics Forum | Mon May 25 07:40:38 EDT 2009 | nibirta
One of our customer wants to change the process from OSP boards to ENIG. His question was: what is the failure rate for ENIG in the last 3 years? well...what to say? I was suggesting a ImAg instead of ENIG. But..nope. Any ideea about this topic? For
Electronics Forum | Thu May 28 22:17:18 EDT 2009 | davef
If your fabricator understands and controls their in-house ENIG, you should be OK. It seems that fabs don't undererstand ENIG processes well enough to duplicate hyper-corroded nickel, but those that have not seen the defect usually never see it.
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
solder ball attach for BGA) on TIMs voiding. Fig. 8 below shows an x-ray result after sTIM reflow, then after subsequent SAC reflow (details later). Fig. 8: Reflow#1 vs. Reflow#2 – same part In the case of Heller Industries, the task was to establish the
winsouce.jpg)