Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry. Multilayer Mixed Dielectric PCB Specifications:
New Equipment | Assembly Services
Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e
Electronics Forum | Mon May 25 07:40:38 EDT 2009 | nibirta
One of our customer wants to change the process from OSP boards to ENIG. His question was: what is the failure rate for ENIG in the last 3 years? well...what to say? I was suggesting a ImAg instead of ENIG. But..nope. Any ideea about this topic? For
Electronics Forum | Tue Jun 02 18:38:13 EDT 2009 | joeherz
Nicoleta, We're a CM and have produced many millions of solder joints with ENIG boards with no failure attributed to this surface finish. This represents several boards houses. Another poster is correct that any supplier you choose should have a c
Used SMT Equipment | AOI / Automated Optical Inspection
M22XDL• Automatic Optical Inspection of PCB’s• Inspects: – SMT & THT Components (presence, type, polarity, offset, text etc)– Reflow and Wave Solder Joints (including meniscus)– Solder Paste (2 dimensional)• High Speed Digital XGA Colour Camera (Came
Used SMT Equipment | AOI / Automated Optical Inspection
Offered systems: 2 x Configurations, consisted from: M22XDL460 AOI ,Power Mac G5 PC, Monitor 17” Vantage: 2006 Condition: good. Marantz Aoi Systems •Automatic Optical Inspection of PCB’s •Inspects: SMT & THT Components (presence, type, polari
Industry News | 2012-10-30 21:59:40.0
The latest devolopments in the OLED lighting space will be one of the major topics at the forthcoming Printed Electronics USA 2012 conference & exhibition (www.printedelectronicsusa.com). The event, being held on December 5-6 in the heart of silicon valley at Santa Clara, CA, USA, focuses on the commercialization of the technology, covering broadly organic, inorganic, thin film and flexible nanotechnologies.
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Parts & Supplies | General Purpose Equipment
Samsung CP45 Machine SMC Compact Cylinder Original Used J9057035C Description: 1, Original Place: Korean 2, Part Name:Cylinder 3, Used For Samsung Machine We are supplying the following Parts CP 8*2MM 8*4MM 12MM 16MM 24MM 32MM 44MM 56MM FEE
Parts & Supplies | Assembly Accessories
Detailed Product Description Original: Japan Name: AC Servo Motor Conditon: Used Usage: CP60L Brand: Samsung Model: P50B02002DXS30 P50B02002DXS30 Servo Motor Driver For Samsung CP60L Z Axis Motor Original Description: 1, Original Place:
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 2021-07-06 21:18:02.0
A new PCB surface finish has been developed that offers outstanding performance and excellent environmental protection. This finish has the potential to replace more common finishes such as ENIG, ImAg, ImSn, ENEPIG, or OSP with a chemically resistant plasma deposited coating. The substitution of the wet processes with this dry plasma process offers significant advantages e.g. lower quantities of chemicals used, environmental benefits and improved operator safety.
World's leading solder paste stencil & emulsion screen inspection system. Used by both stencil/screen fabricators and users to detect errors BEFORE production, eliminating costly rework, scrap and delays. Supports E-form, laser cut, chem etch, hybrid
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
solder ball attach for BGA) on TIMs voiding. Fig. 8 below shows an x-ray result after sTIM reflow, then after subsequent SAC reflow (details later). Fig. 8: Reflow#1 vs. Reflow#2 – same part In the case of Heller Industries, the task was to establish the
