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ENIG PCBs with red soldermask Layers: 2 Base material: FR4 Copper thickness: 1oz Board thickness: 1.6mm Min. hole size: 0.45mm Min. line width: 3 mils Min. line spacing: 3 mils Surface finishing: HASL
This 4-layer Radio Frequency Microwave Board features cavities for SMA connectors and has an ENIG Finish
Electronics Forum | Wed Jan 30 15:46:32 EST 2013 | davef
First, look here [http://www.ti.com/lit/ug/snva500/snva500.pdf ] This is the actual pdf from TI, not some cheap-ass reproduction, like the link you gave us. Orange polygons [and other shapes] - copper covered with ENIG * On the edge of the board, bo
Electronics Forum | Mon Nov 28 09:46:24 EST 2005 | pjc
I have waved gold (ENIG) boards. That's a pretty hot pot at 260C, wow. I have used 245C with good results. All other parameters look OK a glance. Well, PCB temp looks a little hot too at 130C before pot. 90-100C is typical for most No-Clean flux. At
Industry News | 2010-09-29 02:16:12.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its Fine-Pitch SMT Kit is now available in both lead-free and tin-lead versions. The lead-free component option is available with the ENIG board finish.
Industry News | 2019-04-03 20:07:41.0
Practical Components is a leading international distributor of mechanical IC samples or “dummy” components that has added a new SMTA Solder Paste Test Vehicle for Miniaturized Surface Mount Technology (SMT) to its array of Dummy Components, Solder Training Kits and PCB Evaluation Kits.
Technical Library | 2015-11-25 14:15:12.0
In this study various printed circuit board surface finishes were evaluated, including: organic solderability preservative (OSP), plasma finish (PF), immersion silver (IAg), electroless nickel / immersion silver (ENIS), electroless nickel / immersion gold hi-phosphorus (ENIG Hi-P), and electroless nickel / electroless palladium / immersion gold (ENEPIG). To verify the performance of PF as a post-treatment option, it was added to IAg, ENIG Hi-P, and ENEPIG to compare with non-treated. A total of nine groups of PCB were evaluated. Each group contains 30 boards, with the exception on ENIS where only 8 boards were available.
Technical Library | 2023-01-10 20:15:42.0
Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.
Career Center | , India | Engineering,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
I am working as lab chemist and also involved in troubleshooting and process control of various processes in pcb industry
SMTnet Express, August 9, 2018, Subscribers: 31,244, Companies: 11,011, Users: 25,072 New Phosphorus-based Curing Agents for PWB A. Piotrowski, M. Zhang, S. Levchik - ICL-IP , Y. Zilberman, Eran Gluz - IMI As a result of the continuous
| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf
GPD Global | https://www.gpd-global.com/co_website/dispense-solder-mask.php
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