Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Manufacturer
Heller Thermal Systems India location featuring reflow soldering ovens and pressure curing ovens.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Tue Nov 09 17:38:01 EST 2010 | davef
What's your stencil thickness?
Electronics Forum | Tue Nov 09 04:21:11 EST 2010 | bising
Hi SMT World, I am facing a technical challenge related to an SOIC 14lds with thermal pad on it's belly that needs to be soldered onto PCB, together with leads. It is a 50 per board, expected 80% solder load on every one. We have some units without
Used SMT Equipment | SMT Equipment
Product name:KD - 770 JUKI chip mounter Product number: KD - 770 if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype
Used SMT Equipment | SMT Equipment
Product name: KD - 2077 high-speed dispensing machine Product number: KD - 2077 Products in detail Features: High speed dispensing/adapt to more stable range Equal to KE series of high-performance/operability Attaches great importance to the
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
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Parts & Supplies | Screen Printers
DEK spray alcohol solenoid valve -165670 (new) FOR SPARES PLEASE ORDER BRACKET PART NUMBER 165824 TO ENSURE CORRECT FITMENT
Parts & Supplies | Screen Printers
DEK spray alcohol solenoid valve -165670 (new) FOR SPARES PLEASE ORDER BRACKET PART NUMBER 165824 TO ENSURE CORRECT FITMENT
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2024-08-20 00:41:48.0
Thermal interface materials (TIMs) play a pivotal role in ensuring efficient thermal management by facilitating heat transfer between heat generating components and heat-dissipating devices
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Real Time Process Control with FPC: Fluid Pressure Control (Patented) Runs your pump at optimal levels at all times instead of starving or drowning it with inadequate or excessive fluid flow from the reservoir Real Time Process Control (FPC) is a b
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS) Recert.
The Certified IPC/WHMA-A-620 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC/WHMA-A-620 Specialist.
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Events Calendar | Thu Mar 25 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | ,
Webinar: Process Control to Ensure Electrochemically Reliable Electronics
Events Calendar | Tue Dec 03 00:00:00 EST 2019 - Tue Dec 03 00:00:00 EST 2019 | Anaheim, California USA
IPC Tech Ed - Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: 3+ years experience in electronic manufacturing; with SMT new product introductions. Strong DFM experience. Duties/Functions: Provide DFM input to all new products. Interface with design and sustaining engineering to ensure ro
Career Center | Plymouth, Michigan USA | Engineering,Management,Production
Provide technical support and direction to production and development process in manufacturing to ensure up to date processes that run trouble free to build a quality product in the required amount of time. Duties: 1. Provide technical leadership to
Career Center | san jose, California USA | Engineering
Process Eng, Quality supllier, Fianl QA PCBA, BOX build , SAP, Agile, Excell , mir sof word.box build product
Career Center | Laguna, Philippines | Engineering
Advanced knowledge in SMT Machines and Processes. Programming SMT Machines.
| http://etasmt.com/cc?ID=te_news_bulletin,13161&url=_print
soldering technology is used, it is necessary to ensure that the basic requirements of soldering are met to ensure good soldering results
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-services/specialized-services/training-material-evaluation/
. We can assist your Instructors with these processes. OBJECTIVES: Blackfox’s team of experts will evaluate your current training materials to ensure sound instructional design principles are incorporated Evaluation involves a review of your objectives to ensure performance
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