BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi
8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems 8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems Introductions: The mainly component is adopted international bran
Electronics Forum | Mon Mar 19 00:14:44 EST 2001 | zam_bri
Our process mostly are double sided reflow and we are using water soluble paste on ENTEK PCB. Rework WIP has been accumulated since the last 4 months, and upon clearing, one of the method that the test guy use are to reflow the PCB again for one mo
Electronics Forum | Thu Mar 04 07:57:32 EST 1999 | John Godfrey
I need to setup an oven to run with a nitrogen atmosphere for boards with BGA's, but our ovens do not have the optional atmosphere monitor and controller. Is there a good way to sample and control the atmosphere without the optional built-in atmospe
Used SMT Equipment | Soldering - Reflow
A8N Main electric part uses international brand components. Temperature control design achieves international advanced level with stable and even temperature. It is suitable for soldering CSP, BGA component. Energy-saving inner oven design and heat
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
This video describes the features of BTU's Pyramax™ convection reflow oven, including the new dual-lane, dual-speed feature which essentially gives one oven the capability of two ovens. Pyramax ovens are known worldwide for superior reliability, unm
Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal
| http://etasmt.com/cc?ID=te_news_bulletin,23762&url=_print
. The Heller Ultralow II inert atmosphere reflow oven delivers unsurpassed nitrogen economy without sacrificing excellent heat transfer characteristics
| https://www.smtfactory.com/What-is-the-application-prospect-and-development-direction-of-Lyra-Reflow-Oven-id43172477.html
. Lyra Reflow Oven technology is actually a fine process welding technology. The biggest advantage of this technology is that it can weld electronic components to the circuit board on some small circuit boards, so as to meet the needs of enterprises for circuit boards
