Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other
Ludee Circuits offer RoHS PCB.We could offer leadfree HASL,Entek, flash gold, immersion gold, immersion silver, immersion tin finishing based on standard FR-4, CEM-3 materials, Teflon, Rogers RO4000 series, as well as high Tg S1170 materials.
Industry Directory | Manufacturer
Since 1971, Eagle Electronics Inc. has provided our Customers with the highest quality Printed Circuit Boards at fair and competitive prices.
New Equipment | Surface Finish
Increase Yields. Improve Quality. Reduce Rework and Rejects. Enthone provides the world’s most applied and preferred PCB final finishes. Offering the widest selection and deepest knowledge of lead-free compatible finishes, we work with leading OEMs,
New Equipment | Assembly Services
TW-Multilayer PCB 0123 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Y
Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.
Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O
Electronics Forum | Mon Nov 19 20:15:39 EST 2001 | davef
Now, that is one thickass board!!! The rant first: If our �board supplier changed our board surface finish on� anything without our approval, the board supplier would be an �X�. Life has enough surprises. And of all the flat finishes available, h
Industry News | 2011-05-16 16:53:28.0
SMTA China announces that it presented eight overall awards, nine best paper/presentation awards and two best exhibit awards at the SMTA China East 2011 Conference Award Presentation Ceremony, held on Thursday, May 12, 2011 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Fifth Anniversary Gala dinner.
Industry News | 2010-09-22 14:26:54.0
Practical Components Inc., a leading international national distributor of dummy SMD and thru-hole components, test boards, training/setup kits and supplies, announces a new PACTECH PCB310 Flip Chip Test & Evaluation Board for placement and daisy chain continuity testing after assembly.
Parts & Supplies | Circuit Board Assembly Products
Specifications 1.One-stop OEM pcb assembly service. 2.ROHS, SGS, UL certificated 3.Reasonable price 4.High Quality 5.Fast Delivery PCB Assembly&PCBA Service 1. Experienced components sourcing team specially for scarce parts 2.1 to 12 layers m
Parts & Supplies | Circuit Board Assembly Products
Specifications 1.One-stop OEM pcb assembly service. 2.ROHS, SGS, UL certificated 3.Reasonable price 4.High Quality 5.Fast Delivery PCB Assembly&PCBA Service 1. Experienced components sourcing team specially for scarce parts 2.1 to 12 layers m
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
Technical Library | 2023-04-25 22:03:25.0
This report hopes to achieve several goals: 1. Determine the link between bare PWB contamination, soldered assembly contamination and long-term product reliability. 2. Establish measurable limits for bare PWB cleanliness as well as process control limits for both an aqueous as well as a water-soluble soldering process. 3. Determine whether there is any correlation between common, industry-accepted rose/modified rose (omegameter/ionograph type) testing and long term product reliability. 4. Determine the effect PWB plating finish (HASL, Immersion Silver and Cu OSP) has on both bare PWB contamination as well as soldered assembly in a no clean and water soluble process. 5. Determine whether there is a link between percentage of saponifier used to wash soldered assemblies and long-term reliability. 6. Establish a more cost-effective test for manufacturers to use as a process-monitoring tool.
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
XTECH Auctions announces ETM Auction ☀ October 17–21, 2021 SMTnet Express, October 21, 2021, Subscribers: 26,585, Companies: 11,455, Users: 26,807 PCB Surface Finishes & The Cleaning Process - A Compatibility Study All PCBs
SMTnet Express, July 8, 2021, Subscribers: 26,934, Companies: 11,398, Users: 26,743 Effects Of Surface Finish On High Frequency Signal Loss Using Various Substrate Materials The amount of information transferred on wireless networks
| https://pcbasupplies.com/alloy-solder-paste-enig/
: Koki Description Additional information Description High Reliability Alloy Solder Paste For ENIG High Reliability Alloy Solder Paste SAC305 Type-4 No-Clean High Reliability Lead-Free SAC305 Solder
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
% Sn finish OSP over Cu pad Sn63Pb37, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100% Sn finish HASL SnPb over Cu pad The test vehicle designed is shown in Figure 1
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